Jan 21 2011
The new APS etch system will boost the process proficiency of ISIT’s MEMS manufacturing series and helps in the advancement of next generation devices including sensors, actuators, and energy harvesters.
Christian Schroeder, MEMS Technology Manager at FhG-ISIT, remarked that they have opted to include APS to their solutions to their full line of their deep etch processing methodologies for all MEMS and its associated technologies. He explained that with the advent of such systems they were able to execute improved, deep silicon etching, apart from performing complex etches in hard materials, including oxide films, glass,piezoelectric films, and Pyrex.
According to SPTS’ executive vice president, and managing director of Single Wafer Division, Kevin T. Crofton, they are excited to extend their relationship with ISIT and that their APS offers exclusive processing skills with its patented source architecture, meeting customers’ requirements, facilitating the processing with varied materials that are hard to etch by traditional Inductively Coupled Plasma (ICP) devices.
Source: http://www.spp-pts.com