OmniVision Technologies, a company, which develops advanced digital imaging solutions, has launched the OV8850, the 8-Megapixel CameraChip sensor built using 1.1 µ OmniBSI-2 pixel architecture.
With a dimension of ¼”, the OV8850 is to be used in ultra slim smartphones. The OmniBSI-2 not only offers a small footprint but also noteworthy improvements in image quality and power efficiency.
Per Rosdahl, who is the Senior Product Manager of OmniVision, has stated that with the help of the new OmniBSI-2 architecture they had miniaturized or reduced the pixels for offering a 20% improvement in peak quantum efficiency for all color channels, along with a 35% enhancement in low light sensitivity levels.
The OV8850 also includes advanced imaging functions such as context switching, two phase lock loops, an on-chip temperature sensor, and alternate row exposure for HDR video capture. It also incorporates an integrated scaler and 2x2 binning functionality, which provides improved 720p/60 HD video recording inclusive of EIS. This would fit inside an 8.5 x 8.5mm autofocus camera module with a height of 4.7mm. The company plans to sample by August and mass produce in the first quarter of 2012.
Source: http://www.ovt.com