Future Facilities and Intel Plan to Open New Dimension in Server-Embedded Thermal Sensors

Future Facilities, experts in the computational fluid dynamics (CFD) offers a range of integrated software products that cater to the needs of the design engineering and operational management of data centers.

Data management is made possible by thermal sensors that are externally mounted on the front cabinet of the servers maintained by the data centers. The sensors have to be kept cooled to maximize data collection and preservation. 40% of power is focused on keeping the sensors cool and as these sensors are situated outside of the server cabinet, about 30-50% of power is wasted.

Future Facilities has applied a new technology in designing server-embedded thermal sensors that enhance the cooling of sensors with less power consumption. Sherman Ikemoto, the General Manager of Future Facilities, North America assures that the company’s novel CFD design helps minimize the cost of data center infrastructure management (DCIM) and rules out the need for installing external sensors.

Future Facilities has established a Virtual Facility Model featuring server embedded thermal sensors at the Intel Premises, San Francisco. In a press report, Mr. Akhil Docca, the Product Manager of Future Facilities has made a public announcement regarding the company’s proposed discussion with Intel, the world leader in integrated electronics. In the Intel Developer Forum 2012 that is scheduled to take place on September 12th at 10:30 a.m., Mr. Docca and Jay Vincent, the senior technical architect of Intel will focus on a talk regarding the effective functioning of the thermal sensors embedded in Intel’s servers.

The server embedded thermal sensors are aimed at maximizing IT load capacity, CFD analysis, air flow, and CPU utilization with the available real-time power. These are expected to open new dimension in the field of Information Technology.

Source: http://www.futurefacilities.com

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