Bosch is fully committed to developing the world of connected, intelligent devices – a global market that Gartner predicts will reach US$1.9 trillion by 2020.1 Tapping into this enormous market – which Bosch calls “the Internet of Things and Services” (IoTS) – at the 2014 International CES® is no easy feat, but Bosch is uniquely positioned to achieve success: It designs and manufactures the world’s broadest portfolio of micro-electromechanical systems (MEMS), the building blocks of the IoTS.
And it recently launched Connected Devices and Solutions, a new business unit that creates custom IoTS solutions. Combining the Bosch MEMS sensor portfolio with low-power wireless networks, application-specific algorithms and Bosch´s electronics manufacturing technology, Connected Devices and Solutions provides consumers with seamless ways to monitor and interact with their environment.
Bosch’s IoTS demo gives CES attendees real-time readings about their surroundings via 27 wirelessly connected ‘smart sensors’ that are strategically positioned around the booth. The ‘smart sensor’ network uses tiny, intelligent MEMS sensors from Bosch Sensortec and Akustica to monitor and report sound, humidity, pressure, motion, light and temperature data from the booth – all of which is then displayed in a high-quality interactive 3D model.
In addition to a real-time visualization of the booth’s micro-climate and sound level, the ‘smart sensor’ network will also allow booth visitors to participate in a demonstration of simulated intrusion detection via real-time movement tracking of doors and furniture.
Enhanced Gaming Experience
In addition to the IoTS demo, the Bosch booth will also feature ‘Motion Bob,’ a string-free marionette that shows the enhanced gaming experience made possible using Bosch Sensortec’s MEMS motion sensors.
Delivering extreme accuracy and rapid response times, the company’s accelerometers, gyros and magnetometers show how Bosch is advancing the human-machine interface for more interactive gaming
To get the full IoTS experience at the Bosch booth during CES – and to experience the Bosch MEMS sensor portfolio in all its glory – please visit #20812 (Las Vegas Convention Hall, South Hall 1), January 7-10, 2014 during exhibition hours.
Bosch Sensortec CEO to Explore Sensor Fusion
With its MEMS sensors in one out of every two smartphones – and in many of the industry’s bestselling tablets, wearable devices and other consumer electronics as well – Bosch Sensortec is deeply invested in its customers’ successes. Stefan Finkbeiner, CEO and GM of Bosch Sensortec, will explore one of the biggest challenges facing today’s consumer-electronics OEMs in his presentation, “Hardware-Software Co-design: The Secret to Sensor Fusion, ” January 8, 2014, 2:25-2:50 p.m., Room N261, North Hall, Las Vegas Convention and World Trade Center (LVCC), as part of MEMS Industry Group’s CES conference track, MEMS Sensor Fusion - Revolutionizing the Internet of Things.
Second Show Floor Location: MotionTech TechZone
Bosch’s MEMS product portfolio and Bosch Connected Devices and Solutions can also be found in MEMS Industry Group’s MotionTech TechZone, located in the LVCC South Hall 2, at Booth 25736.