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Results 31 - 40 of 784 for Mobile Phones
  • Supplier Profile
    Hamamatsu Photonics is a leading manufacturer of devices for the generation and measurement of infrared, visible, and ultraviolet light. These devices include photodiodes, photomultiplier tubes,...
  • Supplier Profile
    Dongbu Hitek as one of the semiconductor industry's top ten foundries. Operating two world class wafer fabrication facilities and leveraging key technology achievements spanning two deacades, the...
  • Supplier Profile
    Fujifilm is the global leader in broadcast lenses and high-resolution compact lens units that use aspherical lens elements, such as those in mobile phones. Their products compact cameras installed...
  • Supplier Profile
    OmniVision Technologies is a leading developer of advanced digital imaging solutions. OmniVision's broad portfolio of CMOS image sensors serves a wide variety of end markets and enables superior...
  • Supplier Profile
    Superior Sensor Technology is an innovative, high technology company committed to producing a new generation of integrated, high-performance, low-pressure sensors for industrial, medical and...
  • Supplier Profile
    Amazing insights and innovative products using Tekscan pressure mapping, force measurement, and tactile sensors Tekscan's patented tactile force and pressure sensing solutions provide our...
  • News - 22 Mar 2010
    Reportlinker has released its 4th Edition report on GPS and Mobile Handsets. The report will enable readers from the mobile phone industry and users to ascertain the hurdles and opportunities for...
  • Supplier Profile
    DSP Group®, Inc. (NASDAQ: DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and hardware...
  • Supplier Profile
    Founded in 2002, Goodix (formally known as Shenzhen Huiding Technology Co., Ltd.) is a premier developer and manufacturer of human interface and biometric technologies for mobile phones, tablets and...
  • News - 11 Jun 2012
    ESCATEC, the EMS innovator, has added Package-on-Package (PoP) capability to its production facilities at Heerbrugg in Switzerland. PoP enables one BGA package, such as a memory chip, to be soldered...

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