Providing Quality & Purity Control with Electrochemical Oxygen Analyzers in the Electronics Industry

Oxygen Analyzers

Advanced manufacturing of electronics components frequently requires ideal environmental conditions to realize top product quality, maximum yield, and avoid expensive product flaws.

Usually, distinct oxygen gas concentrations are necessary to enable, for example, a curing oven or a solder furnace to maintain ideal process integrity so as to yield desired product quality and reduce scrap costs.

Applications

Oxygen analyzers can be employed in the following applications:

  • PC board manufacturing, solder machines
    • Fluxless solder pastes created to stop the use of CFCs in washing boards
    • Wave and reflow soldering
    • Require the use of an inert atmosphere in the solder machine to avoid bad joints due to oxide formation
  • Furnace applications in the production of components such as capacitors
  • Certain special assembly processes sensitive to oxygen need glove boxes with inert gas

Blanketing Gas Quality Monitoring

Application/Service Measurement Gas Stream Suggested
Analyzer
O2 contamination in N2 gases used in inert reflow soldering and wave soldering 0-10 ppm O2 N2 GPR-1600

Spot Checking
GPR-1200

Blanketing in Curing Processes

Application/Service Measurement Gas Stream Suggested
Analyzer
Monitoring of low level oxygen for inert blanketing in curing ovens during curing process 0 to 100 ppm O2 Varies GPR-1600

Blanketing of Electronic Packaging

Application/Service Measurement Gas Stream Suggested
Analyzer
O2 contamination in N2, H2 gases used in the packaging of integrated circuits 0-10 ppm O2 N2 GPR-1600

Spot Checking
GPR-1200

Nitrogen Quality Control

Application/Service Measurement Gas Stream Suggested
Analyzer
Control of high ppb cryogenic N2 Purity for production furnaces 0 to 1 ppm O2 N2, Ar, H2, He PI2-MS 500/1000

Spot Checking
GPR-1200 MS

Personnel Protection

Application/Service Measurement Gas Stream Suggested
Analyzer
O2 deficiency in confined areas <19.5-20.0% O2 Air, N2 GPR-35

Quality Control of Furnace Fuel

Application/Service Measurement Gas Stream Suggested
Analyzer
Measurement of ppm purity of furnace fuel gas for sintering ceramic powders into shapes 10 ppm to 1% O2 Fuel gas GPR-1600
GPR-1900
GPR-2600

Spot Checking
GPR-1200
GPR-2000

Quality Control of Furnace Fuel

Application/Service Measurement Gas Stream Suggested
Analyzer
Measurement of ppm purity of furnace fuel gas for sintering ceramic powders into shapes 0.5% to 100% O2 Fuel gas GPR-2900

Quality Control of Gas Generator Skids

Application/Service Measurement Gas Stream Suggested
Analyzer
Control of ppm purity cryogenic, ceramic membrane, pressure swing adsorption (PSA) skid and deoxo catalytic generated N2 (5 nines) 0-10 ppm O2 N2, Ar, H2, He GPR-1600

Spot Checking
GPR-1200
GPR-1100

Quality Control of Inerting Gas

Application/Service Measurement Gas Stream Suggested
Analyzer
O2 contamination in controlled atmospheres used for various sealing, firing and soldering processes to join dissimilar materials 0-10 ppm O2 N2 GPR-1600

Spot Checking
GPR-1200

Control Purity of Nitrogen in Solder Reflow Ovens

Control Purity of Nitrogen in Solder Reflow Ovens

Reflow soldering is the most widely used form of attaching surface mount components to printed circuit boards (PCBs). The solder paste is coated on the PCB that is then exposed to a controlled heating and cooling profile to curtail defects.

What Is Reflow Soldering?

The term "reflow" is used as the solder is melted and then heated again and it re-flows. To decrease oxidation on the soldered surfaces, certain ovens accomplish the reflow phase under nitrogen (N2) blanketing to guarantee an oxygen-free environment. (O2 < 10 ppm). This process additionally diminishes defects in the product. Oxygen monitoring allows control of the N2 supply to guarantee product quality as well as savings on gas consumption. Usually, galvanic electrochemical sensors can be used to measure the O2.

Blanketing Gas Quality Monitoring

Application/Service Measurement Gas Stream Suggested
Analyzer
O2 contamination in N2 gases used in inert reflow soldering and wave soldering 0-10 ppm O2 N2 GPR-1600

Spot Checking
GPR-1200

Blanketing of Electronic Packaging

Application/Service Measurement Gas Stream Suggested
Analyzer
O2 contamination in N2, H2 gases used in the packaging of integrated circuits 0-10 ppm O2 N2 GPR-1600

Spot Checking
GPR-1200

Personnel Protection

Application/Service Measurement Gas Stream Suggested
Analyzer
O2 deficiency in confined areas <19.5-20.0% O2 Air, N2 GPR-35

This information has been sourced, reviewed and adapted from materials provided by Analytical Industries Inc.

For more information on this source, please visit Analytical Industries Inc.

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