Master Bond’s advanced die attach adhesives are increasingly accepted for the most demanding microelectronic semiconductor packaging as well as for chips-on-board assemblies. Both one component heat curing and premixed and frozen formulations are available. They include electrically and thermally insulative, thermally conductive, electrically insulative and thermally-electrically conductive compounds. For special uses fast curing two component systems are offered. They all offer outstanding bonding strength for adhering components directly onto printed circuitry.
The Master Bond die attach epoxy compounds are 100% reactive and do not contain any volatiles. They have excellent resistance to both thermal cycling and mechanical shock and vibration. Their dimensional stability is remarkable, even upon prolonged exposure to adverse environmental conditions. These high performance epoxy compounds can be readily dispensed by syringes and other conventional devices as well as by specialized printing technologies. For certain optoelectronic uses unique UV curable compounds are employed as they offer unmatched curing speeds and hence higher productivities.
- High Reliability
- Fast Curing
- Low Stress Void Filling
- Moisture & Chemical Resistant
- Solvent Free
- Outstanding Adhesion to Mismatched CTE's
- Low Outgassing
- Thermal Stability
- Exceptional Physical Strength Properties
- Adjustable Volume Resistivity
- High Thermal Conductivity
- Low Ionic Impurities
- Easily Dispensed
Some of Our Most Popular Die Attach Products
||One part, electrically conductive epoxy with low resistance. Good strength properties. Cures at 125-150°C. Meets NASA low outgassing specifications and offers superior temperature resistance.
||Two part, rapid curing epoxy system with high temperature resistance. Gun dispensable.
||Fast curing at ambient or elevated temperatures. High thermal conductivity. Electrically insulative. Meets NASA low outgassing specifications.
Master Bond Die Attach Adhesives are Used in a Wide Range of Applications
Master Bond Die Attach Systems are for use in semiconductor packaging for medical, military, communication, and general electronic assembly applications:
- Sic or GaN diodes and transistors
- Chip on Board or Multi Chip Module Applications
- Light Emitting Diode Assembly
- Optoelectronic Components
- High Power communication devices
- High power processors, memory, and ASICs
- Power Transistors
- Voltage regulators
- CMOS image sensors
- Microwave Devices
- Laser diodes for fiber optic devices
- RF Power Amplifiers for Wireless infrastructures
High Reliability & Performance
Master Bond's die attach adhesives are designed to offer superior quality and long term durability. They have earned a well deserved reputation for their performance upon exposure to hostile environmental conditions. Select from a wide range of systems conveniently packaged for ease of use. These compounds are available in different viscosities, cure times, chemical resistances, electrical properties, colors, etc. to best meet specific requirements. They are presently employed in the assembly of many critical electronic devices used in commercial, military, space and medical applications.
Electronic Grade Polymers for Electronic Manufacturing by Master Bond
Master Bond’s line of microelectronic formulations consists of epoxies, silicones, polyurethanes, acrylics and latex solutions. They include electrically insulative, thermally conductive and electrically conductive systems. Both one and two component compounds are available for use. These products are currently employed in applications ranging from heat sinking to glob tops to surface mounting. Many of these compounds have unique properties such as low thermal expansion coefficients, exceptionally high thermal conductivity, low stress, etc. Master Bond is also actively engaged in developing new products to keep pace with the rapid technological advancements in the microelectronic industry ranging from flip-chip technology to advanced die-attach processes.
Master Bond offers specialty systems for computers, telecommunications devices, audio/video devices, avionics and aerospace applications, as well as automotive manufacturing, interactive circuitry and advanced semiconductor equipment.