Epoxies, Silicones, Polyurethanes, Polysulfides and UV Cures Designed for the Assembly of Electrical Devices By Master Bond

Master Bond Inc. formulates a wide range of epoxy, silicone, polyurethane, polysulfide, cyanoacrylate and UV cure systems for manufacturers of electrical devices. Our compounds are designed to increase productivity, save energy, improve product performance properties and reliability.

Specific Master Bond grades offer:

  • Improved durability
  • High and low temperature serviceability
  • Excellent adhesion
  • Resistance to vibration, impact, shock and thermal cycling
  • Withstand exposure to a wide range of chemicals and water
  • Superior electrical insulation properties
  • Comply with UL94V-0 flame retardant specification
  • Thermal and electrical conductivity
  • Ambient, elevated temperature or UV cures
  • NASA low outgassing approved

Most Popular Products

Product Description
FL901S Heat cured film adhesive with low volume resistivity. Bonds well to metals and high temperature plastics. Service temperature range of -100ºF to 400ºF. Standard size is .003 thick x 2 inches wide x 6 inches long. Die cuts available
SUPREME 10HT/S One part, heat cured structural epoxy with long working life. Excellent shear and peel strength. Cryogenically serviceable down to 4K. Heat resistant to 400ºF. Screen printable. Low volume resistivity of <103 ohm-cm.
EP21HT Two component, room temp curing adhesive, sealant and coating. Volume resistivity of 1014 ohm/cm. Dielectric constant of 2.90. Excellent insulation and a one-to-one mix ratio. High mechanical strength properties. Tensile lap shear aluminum to aluminum, 3200 PSI at 75ºF.

Master Bond Products are Used in a Wide Range of Electrical Devices

  • Line voltage regulators
  • Electronic meters
  • Transformers
  • Voltage regulators
  • Armature relays
  • Crane and hoist controls
  • Electromagnetic brakes and clutches
  • Industrial controls
  • Motor starters, contactors, and controllers
  • Numerical controls
  • Relays
  • Solenoid switches
  • Electrical motor assembly
  • Circuit breakers
  • Electric power distribution apparatus
  • Fuse clips and blocks
  • Generator control and metering panels
  • Power connectors
  • Electrical switchgear apparatus
  • Torque motors
  • Specialty battery chargers
  • Capacitors
  • Condensers
  • Rectifiers
  • Thermoelectric generators
  • Signaling apparatus
  • Intercommunication equipment
  • Accelerating waveguide structures
  • Particle accelerators

Packaged the Way You Need It

We offer a wide array of packaging options to speed productivity, minimize waste and save energy including...

  • Quantities from grams to gallons
  • Cans, bottles and jars
  • Cartridges for manual and pneumatic guns
  • Premixed and frozen syringes
  • Bipaks for field service kits

New Adhesives For Electrical Device Manufacturing

Supreme 46HT-2 High temperature resistant epoxy adhesive resists exposure up to 500°F/ Has high bond strength and superior toughness. Excellent electrical insulation properties.
EP21AN Thermally conductive, electrically insulative epoxy has convenient, non-critical one to one mix ratio. Dielectric strength > 400 volts/mil. Thermal conductivity is 22 BTU/in/ft2/hr/°F. High dimensional stability.
EP30HT Medium viscosity, two component epoxy adhesive cures at room temperature. Temperature resistance up to 400°F. Superb optical clarity and electrical insulation properties.
EP24 Fast curing, one to one mix ratio epoxy adhesive. Bonds well to similar and dissimilar substrates. Superior chemical resistance. Will cure at colder temperatures.

Electronic Grade Polymers for Electronic Manufacturing by Master Bond

Master Bond’s line of microelectronic formulations consists of epoxies, silicones, polyurethanes, acrylics and latex solutions. They include electrically insulative, thermally conductive and electrically conductive systems. Both one and two component compounds are available for use. These products are currently employed in applications ranging from heat sinking to glob tops to surface mounting. Many of these compounds have unique properties such as low thermal expansion coefficients, exceptionally high thermal conductivity, low stress, etc. Master Bond is also actively engaged in developing new products to keep pace with the rapid technological advancements in the microelectronic industry ranging from flip-chip technology to advanced die-attach processes.

Master Bond offers specialty systems for computers, telecommunications devices, audio/video devices, avionics and aerospace applications, as well as automotive manufacturing, interactive circuitry and advanced semiconductor equipment.

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