Posted in | Device Assembly

High Precision and Stand-Alone Photonic Device Assembly Systems

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ficonTEC’s AssemblyLine systems are high-precision, rapid-active alignment stand-alone, and in-line assembly solutions built for automatic production (align-and-attach) of photonic devices. They exceptionally integrate active alignment features and flexible attachment configurations with well-proven software control interface, all in an industry-established design. Optional modules offer extra features, with the high-end models offering automatic tool swapping, test modules, and wafer processing capability.

ficonTEC’s next-generation in-line assembly systems use a redesigned platform (400, 800, 1200, 1600). They are provided in precise in-line configurations as an individual and adaptable production cell for current production lines, or they can be delivered as task-enhanced production segments comprising a number of differently configured systems. Basically, even complete production lines can be visualized.

ficonTEC - Next-generation In-line Photonics Assembly & Test Systems

Software Control

ProcessControlMaster (PCM) is ficonTEC’s user-friendly and process-oriented application software and control interface that is dispatched with all turn-key systems and multi-machine configurations. PCM features an intuitive UI that comprises of all machine vision, active positioning and system management routines needed to consistently and repeatably stimulate passive/active alignment and attachment/bonding process hardware. It also is delivered fully enabled for automated electro-optical test and characterization operations, as well as having the ability to operate, track, and sync parallel lines remotely.

Key Features

Fully-automated photonic device assembly
Configurable, closed-loop rapid-active alignment
High-precision AUTOALIGN multi-axis motion
Epoxy dispensing, curing, and shrinkage control
Various chip and wafer handling options

General Tasks and Applications

Chip-to-package assembly
Thermal or UV curing
Pick-and-place
Precision adhesive dispensing
Active mirror align-and-attach
Active VBG spectral tuning
Fiber/FAC/SAC align-and-attach
HPLD module assembly
Hybrid integrated photonics
PICs, Silicon Photonics

Flexible, Modular and (Re-)Configurable

Operate, monitor, and sync parallel lines remotely
FAB and HVM-ready – Scalable and parallelizable
Single systems slot into current production lines
Add and/or swap components to reconfigure and repurpose
Daisy-chain many systems for production segments
High-tech feed IN/OUT options

Core system specifications
Motion system	4-axis alignment	gantry system with min. 6-axis high-precision alignment*	gantry system with min. 6-axis high-precision alignment* or cantilever system w/o multi-axis system	cantilever system with min. 6-axis high-precision alignment*
Working area (max) (w x b x h, mm)	100 x 200 x 200	100 x 300 x 50**	200 x 300 x 50**	200 x 100 x 50**
Handling options	single conveyor		single or dual conveyor
Wafer capable	no		up to 6”	up to 12”
Machine vision	standard/dual positioning and observation camera options
Feed options	suitable for Jedec or Auer boats, or for customer trays
Software features	ergonomic, flexible and powerful process software – extended operator-less control – remote control server option
Physical features	rugged steel-base production cell - access door lifts vertically without affecting footprint
Minimum connections	400 VAC (or country specific), air/vacuum, 100 Mbit/s network
Cleanroom compliance	ISO 6***
Dimensions (w x b x h, mm)	400 x 1200 x 1600/2000	800 x 1200 x 1600/2000	1200 x 1200 x 1600/2000	1600 x 1200 x 1600/2000
Weight (typ., kg)	600	1300	1800	2500