Posted in | Device Assembly

High Precision and Stand-Alone Photonic Device Assembly Systems

ficonTEC’s AssemblyLine systems are high-precision, rapid-active alignment stand-alone, and in-line assembly solutions built for automatic production (align-and-attach) of photonic devices. They exceptionally integrate active alignment features and flexible attachment configurations with well-proven software control interface, all in an industry-established design. Optional modules offer extra features, with the high-end models offering automatic tool swapping, test modules, and wafer processing capability.

ficonTEC’s next-generation in-line assembly systems use a redesigned platform (400, 800, 1200, 1600). They are provided in precise in-line configurations as an individual and adaptable production cell for current production lines, or they can be delivered as task-enhanced production segments comprising a number of differently configured systems. Basically, even complete production lines can be visualized.

ficonTEC - Next-generation In-line Photonics Assembly & Test Systems

Software Control

ProcessControlMaster (PCM) is ficonTEC’s user-friendly and process-oriented application software and control interface that is dispatched with all turn-key systems and multi-machine configurations. PCM features an intuitive UI that comprises of all machine vision, active positioning and system management routines needed to consistently and repeatably stimulate passive/active alignment and attachment/bonding process hardware. It also is delivered fully enabled for automated electro-optical test and characterization operations, as well as having the ability to operate, track, and sync parallel lines remotely.

Key Features

  • Fully-automated photonic device assembly
  • Configurable, closed-loop rapid-active alignment
  • High-precision AUTOALIGN multi-axis motion
  • Epoxy dispensing, curing, and shrinkage control
  • Various chip and wafer handling options

General Tasks and Applications

  • Chip-to-package assembly
  • Thermal or UV curing
  • Pick-and-place
  • Precision adhesive dispensing
  • Active mirror align-and-attach
  • Active VBG spectral tuning
  • Fiber/FAC/SAC align-and-attach
  • HPLD module assembly
  • Hybrid integrated photonics
  • PICs, Silicon Photonics

Flexible, Modular and (Re-)Configurable

  • Operate, monitor, and sync parallel lines remotely
  • FAB and HVM-ready – Scalable and parallelizable
  • Single systems slot into current production lines
  • Add and/or swap components to reconfigure and repurpose
  • Daisy-chain many systems for production segments
  • High-tech feed IN/OUT options
Core system specifications
Motion system 4-axis alignment gantry system with min. 6-axis high-precision alignment* gantry system with min. 6-axis high-precision alignment*
cantilever system w/o multi-axis system
cantilever system with min. 6-axis high-precision alignment*
Working area (max)
(w x b x h, mm)
100 x 200 x 200 100 x 300 x 50** 200 x 300 x 50** 200 x 100 x 50**
Handling options single conveyor single or dual conveyor
Wafer capable no up to 6” up to 12”
Machine vision standard/dual positioning and observation camera options
Feed options suitable for Jedec or Auer boats, or for customer trays
Software features ergonomic, flexible and powerful process software – extended operator-less control – remote control server option
Physical features rugged steel-base production cell - access door lifts vertically without affecting footprint
Minimum connections 400 VAC (or country specific), air/vacuum, 100 Mbit/s network
Cleanroom compliance ISO 6***
(w x b x h, mm)
400 x 1200 x 1600/2000 800 x 1200 x 1600/2000 1200 x 1200 x 1600/2000 1600 x 1200 x 1600/2000
Weight (typ., kg) 600 1300 1800 2500


*alternative multi-axis configurations optional
**working area with 6-axis system
***others available on request

High Precision and Stand-Alone Photonic Device Assembly Systems

ficonTEC’s AssemblyLine systems - Picture 1
ficonTEC’s AssemblyLine systems - Picture 2
High-precision alignment unit
Fiber/FAC/SAC attach
Adhesive dispensing
Silicon Photonics
Die sorting
Fiber alignment
Thermal or UV curing
ficonTEC’s AssemblyLine systems - Picture 3

Other Equipment