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GEMINI® Automated Production Wafer Bonding System from EV Group

A maximum level of automation and process integration is achieved by the Gemini Automated Production Wafer Bonding System. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a big choice of process variations like anodic, silicon fusion, thermo-compression and eutectic bonding.

Features

  • Fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding
  • Configuration options for bottom side, IR or SmartView alignment
  • Multiple bonding chambers
  • Wafer handling system is separated from bond chuck handling system
  • Modular design with swap-in modules
  • Combines all benefits from EVG's precision aligners and EVG500 series systems
  • Minimized footprint compared to stand-alone systems
  • Options:
    • Low Temp plasma bonding
    • Wafer cleaning
    • Coat module
    • UV bond module

Other Equipment

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