A maximum level of automation and process integration is achieved by the Gemini Automated Production Wafer Bonding System. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a big choice of process variations like anodic, silicon fusion, thermo-compression and eutectic bonding.
Features
- Fully automated and integrated platform for wafer-to-wafer alignment and wafer bonding
- Configuration options for bottom side, IR or SmartView alignment
- Multiple bonding chambers
- Wafer handling system is separated from bond chuck handling system
- Modular design with swap-in modules
- Combines all benefits from EVG's precision aligners and EVG500 series systems
- Minimized footprint compared to stand-alone systems
- Options:
- Low Temp plasma bonding
- Wafer cleaning
- Coat module
- UV bond module