Funding kicks mass production of rugged piezoelectric microphones into high gear for voice-first applications, smartphones, hearables, IoT devices and connected cars.
Oceanic sensor networks that gather & communicate superior, real-time data adds to knowledge of marine ecology, advance pollution & disaster management.
Recent research shows that an acoustic blockage-detection system could prevent accidents in the future by alerting pilots about a blocked Pitot.
A seismic station for investigating the presence of hydrocarbon has been created and analyzed at the MIPT Center for Molecular Electronics (CME). The innovative device has an unprecedented bandwidth which allows it to uncover the structure of underground reservoirs even at depths of tens of kilometers.
TDK Corporation announced today that TDK’s wholly-owned subsidiary InvenSense, Inc., a leading provider of MEMS sensor platforms, is hosting the 2017 TDK Sensors Developers Conference.
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, today announced Qualcomm® Fingerprint Sensors, next-generation ultrasonic fingerprint solutions which bring new and enhanced features to the previous generation Qualcomm® Snapdragon Sense™ ID fingerprint technology.
Since Tesla is equipping all its vehicles with the same sensor suite for self-driving, the company doesn’t have the luxury to install racks of sensors hanging around its cars like other firms developing self-driving technology only on test vehicles.
InvenSense, Inc., a leading provider of MEMS sensor platforms, and GLOBALFOUNDRIES, a leading provider of advanced semiconductor manufacturing technology, today announced their collaboration on an ultrasonic fingerprint imaging technology for InvenSense UltraPrint™ Ultrasound Fingerprint Touch Sensor Solution.
Expanding its suite of next generation ultrasound transducers based on semiconductor technologies, Kolo Medical announced today that it will introduce three new SiliconWave™ transducers at the 2016 IEEE International Ultrasonics Symposium (IUS) in Tours, France, September 18-21, 2016.
Diamond-based microstructures have been mathematically modeled by physicists from the Technological Institute for Superhard and Novel Carbon Materials, the Siberian Federal University and the Moscow Institute of Physics and Technology, to produce compact, highly sensitive sensors.