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Aptina Launches 1.4-Micron Pixel MT9F002 Sensor for Advanced Imaging

Aptina, a pioneer in CMOS imaging technology, declared the launch of their latest MT9F002 imagers with 14 Megapixel (MP) resolutions. The device is based on the innovative Aptina A-Pix pixel technology of the company with an enhanced 25% dim-light sensitivity and is capable of capturing intensive, high-grade stationary images compared to the company’s earlier version of 14MP imagers.

The fast MT9F002 sensor features an advanced 1.4-micron pixel offering digital re-sampling and electronic image stabilization (EIS) characteristics. The unique sensor has complete HD video capability in the range of 1080p/60fps with sensitive, rapid connection options encompassing four-lane or parallel MIPI and four-lane HiSPi (high-speed serial pixel interface). With the advent of all these functionalities, the MT9F002 sensor facilitates the development of digital still camera (DSC) and hybrid devices and distinguished mainstream products.

The company’s Aptina A-Pix technology encompasses a deep photodiode, lightguide and 65 nm pixel configuration that is capable of enhancing the pixel effectiveness with low-cost. The unique technology strengthens the quantum operation and lowers crosstalk to take discrete images with brilliant colors even in dim-light environments in comparison with the conventional imagers. This specific technology can be employed in cell phones to capture high-grade images than the digital cameras, and generates a new hybrid camera coupling the still digital image shooting with high-quality HD video. Aptina is launching various 1.4-micron products to strengthen the Aptina A-Pix technology ranging from a 14MP sensor for use in mobile phone handsets and DVC to a 3MP imager for current mobile handsets.

The advancements in the design of both the models and the integration of 1.4-micron pixel to the latest imager highlights the company’s dedication towards delivering innovative technologies into the consumer products.

The sensor can be accessible in a parallel or bare die package for MIPI as well as iLCC 48-pin package for HiSPi.


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