The new interferoMETER sensor, the IMP-NIR-TH3/90/IP68, is specially developed for demanding production environments: 90 ° beam guidance, IP68 protection class, and an integrated air purge device enable precise thickness measurements of silicon and silicon carbide wafers directly in the process – even in confined installation situations and with high levels of particle contamination, such as in slurry grinding.
Image Credit: Micro-Epsilon
With the IMP-NIR-TH3/90/IP68 sensor, Micro-Epsilon is expanding its interferoMETER portfolio with a particularly robust sensor for inline thickness measurement of Si and SiC wafers. The sensor has a 90 ° beam path and a small working distance of just 3 mm, making it ideal for applications with very limited installation space.
Stable Measurement in the Grinding Process
The sensor really comes into its own in demanding processes such as slurry grinding: The robust IP68 stainless steel housing enables use directly in the machine, even with high levels of humidity and particle contamination. Clean optical equipment is particularly important for grinding and lapping processes. This is ensured by the integrated air purge device, which keeps the optical equipment permanently free of particles and thus enables stable measurements.
90 ° Beam Guidance for Confined Installation Situations
A key feature of the sensor is the 90 ° beam path, which enables integration even in very limited installation space. The working distance of just 3 mm and the very small light spot with a diameter of 15 µm form the basis for precise inline measurements directly in the machine. The IMP-NIR-TH3/90/IP68 sensor is operated with the IMS5420 controller and provides a compact, reliable solution for measuring highly doped wafers, where high signal quality is crucial.