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Airborne Sensor for Cost-Effective Wafer Inspection

CyberOptics Semiconductors is to showcase its Airborne Particle Sensor (APS) at Semicon Korea, to be held between Jan 26 and 28 in Seoul. The device will be used in wafer processing equipment. The new device along with its line of products will be showcased at the event by the company’s Korean distributors, Semiconductor Software and Engineering Solutions.

The device will be used in semiconductor processing and automation material handling. The information it collects during its movement will be transmitted to engineers at a central point so that they can verify and analyze wafer contamination in a time bound manner, thus minimizing costs and ensuring that the quality of the process equipment is flawless. This procedure will improve die-yield and make wafer inspection cost and time effective.

The device will be able to identify and categorize the source of each particle during the change in position of the wafers. Split valves will be actuated, and the device will ensure that the compartments are cleaned and used turn by turn. The entire process will facilitate speedy rectification of errors, thus ensuring top quality of the components.

The device will utilizes a fan to drag non-corrosive gas or air down a pipe with a laser beam highlighting the vapor as molecules disperse light on the photodiode of the device. The device can be used with front-ends, tracks of coaters or developers, and equipment used for placement and etching. It will be able to identify molecules as small as 0.1 um in many Bin schemes. The device is easy to use, eliminating the need for expert handling, while also ensuring that it does not get exposed to the environment outside. The information gathered by the engineers remotely will help them make comparisons with previous records and analyze machine to machine data as well.

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