The Manufacturing Test Systems unit of Acculogic, a pioneer in manufacturing and marketing electronic devices and production solutions, launches its innovative ThermoScan™ test technology. The unique ThermoScan™ sensing device can be integrated for common applications on flying probe modules or on Z-motioned probes for precise measurement of the integrated circuits (ICs).
The test systems involving the flying probes are substituting the conventional fixture-oriented bed-of-nails (BON) in-circuit test (ICT) systems, which comprises the dense printed circuit boards (PCBs) with tiny test pads or without the test pads. The highly-complicated integrated ball grid array (BGA) IC technologies with fine pitches have remarkably lowered the free-space. The complexity of the board also restricts the efficiency of test strategies and traditional inspection procedures.
The Flying ThermoScan™ technology employs the mechanical potential of the flying probe to drift an infrared temperature sensor automatically towards the PCB in order to calculate the pattern of temperature on the powered PCB. This novel test methodology connects the gap in the traditional test technologies.
This ThermoScan™ sensor technology can be deployed in all stages of the manufacturing process. It can also be exploited for structure verification and it optimizes temperature distribution. This enhances the mean-time between failure (MTBF) for field products, lowering the warranty expense apart from repairing the field returned PCBs. Acculogic’s ThermoScan™ rapidly furnishes vital troubleshooting data, thus reducing the time taken for repairing it.
The test sensor is capable of monitoring and evaluating the thermal distribution pattern of single as well as double-sided PCBs. The sensor system operates on temperatures ranging from -18°C to 220°C with 3% accuracy in measurements. The response time of the sensor is 150 ms corresponding to a warm-up time of 1 to2 minutes.