Jun 29 2016
Advanced APS2 measurement technology incorporates a wider range of particle sizes. CyberOptics’ Auto Multi Sensors Named “Best of West” Finalist for SEMICON 2016 by SEMI and Solid State Technology
CyberOptics® Corporation (NASDAQ: CYBE), a leading global developer and manufacturer of high precision 3D sensing technology solutions, announces it will showcase its next-generation Advanced Airborne Particle Sensors, that incorporate large particle sensing capability. Both the WaferSense® and ReticleSense® Airborne Particle Sensors (APS2, APSR and APSRQ) will be able to measure small and large particles. Products will be on display at the upcoming SEMICON West 2016, the premier event for the global semiconductor industry, in San Francisco July 12-14, 2016, booth #2323.
CyberOptics’ APS2 portfolio improves equipment set-up and long-term yields in semiconductor fabs by wirelessly monitoring airborne particles in real-time. The next-generation APS2 provides even greater versatility, with the industry-leading accuracy and sensitivity valued by semiconductor fabs and equipment OEMs worldwide. The new large particle detecting and measurement functionality covers a range of sizes with four bins for particles larger than 2, 5, 10 and 30 microns.
CyberOptics will also demonstrate its WaferSense and ReticleSense Auto Multi Sensors (AMS/AMSR) that measure leveling, vibration, and relative humidity (RH) in an all-in-one wireless real-time device.
We’ve evolved our widely adopted APS technology portfolio to include large particle measurement capability in the same devices our customers are routinely using to detect and measure small particles. Equipment and process engineers can speed equipment qualification, shorten maintenance cycles, and lower equipment expenses with objective and reproducible data – saving our customers time and money with a dual particle measurement capability.
Subodh Kulkarni, President and CEO of CyberOptics.
Recently announced as a 2016 “Best of West” Award Finalist by SEMI and Solid State Technology, the thin and light form factor enables the AMS to travel through virtually any tool. The AMSR can capture multiple measurements in all locations of the reticle environment. The all-in-one devices are yet another way to increase yield and reduce downtime in semiconductor environments.