CyberOptics® Corporation, a world leader in intelligent inspection and sensing solutions for electronics assembly and semiconductor process equipment, will demonstrate the ReticleSense™ Airborne Particle Sensor (APSR) at the upcoming SPIE Advanced Lithography conference and exhibition in Booth # 305 in San Jose, CA February 23-27th.
The APSR enables lithography engineers to monitor airborne particles in semiconductor process equipment where reticles are implemented to improve system set-up and long-term yields.
“CyberOptics leveraged its current WaferSense® wafer-shaped Airborne Particle Sensor (APS) technology and created an APS in a reticle-shaped form factor. This was developed with input from world leaders in the semiconductor industry associated with the lithography process. CyberOptics continues to build on a rich history of pioneering technology by developing innovative and effective solutions that improve semiconductor fab productivity and reduce costs for a minimal upfront investment,” said Subodh Kulkarni, President and CEO of CyberOptics.
Lithography engineers can rely on this proprietary technology, which is an extension of the proven WaferSense wafer-shaped Airborne Particle Sensor (APS) device launched in 2011 and in use at semiconductor fabs worldwide including the three largest manufacturers where a contamination-free environment is critical.
“Unlike traditional methods, the wireless, real-time capability of ReticleSense APSR allows users to quickly identify geographic particle sources in reticle environments. Further, APSR can go anywhere a reticle can go and can be transported any way a reticle is transported, without opening the tool. Improving tool uptime, optimizing maintenance and improving yields are all potential outcomes using the ReticleSense and WaferSense measurement devices,” commented Mark Hannaford, Director of Sales and Marketing of CyberOptics.
In addition to the new ReticleSense APSR, CyberOptics will also showcase the entire WaferSense product line. This includes its WaferSense wafer-shaped form factor products adopted by the semiconductor industry since 2004 that provide leveling, gap measurement, robot teaching, vibration measurement and airborne particle detection solutions. WaferSense products are available in 200mm, 300mm and 450mm wafer sizes.
Founded in 1984, CyberOptics Corporation is a leading provider of sensors and inspection systems that provide process yield and through-put improvement solutions for the global electronic assembly and semiconductor capital equipment markets. The company is repositioning itself as a developer and manufacturer of high-precision, proprietary 3D sensors for the electronics and general metrology markets. Headquartered in Minneapolis, Minnesota, it conducts worldwide operations through facilities in North America, Asia and Europe.
Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required for meeting customer orders; the effect of world events on our sales, the majority of which are from foreign customers; product introductions and pricing by our competitors; the level of revenue and loss we achieve in the remainder of 2013; the level of revenue and profit or loss we achieve in 2014; success of anticipated new OEM and end-user opportunities; and other factors set forth in the Company’s filings with the Securities and Exchange Commission.