Posted in | Motion Sensor

New Automotive Airbag Accelerometers from STMicroelectronics

STMicroelectronics, a global provider of automotive MEMS (Micro-Electro-Mechanical Systems) sensors and ICs, has unveiled a novel series of intense-g acceleration sensing units for improved airbag systems. These micro-machined solutions help identifying the speedy deceleration of vehicles at times of crash and will relay spontaneous data to the airbag regulatory unit.

ST’s expertise in automotive MEMS sensors, its partnership with major car manufacturers and its dedication towards the delivery of high-grade solutions have proved advantageous to the airbag-system fabricators. In comparison with the other system providers, the company possesses large-scale manufacturing potency by offering 8-inch MEMS fab, along with its advanced innovative motion sensor configuration and evaluation efficacies.

The company’s AIS1xxxDS surface-sensing accelerometers furnishes one-axis in-plane motion sensing throughout five entire-scale ranges in the order of +/- 20 g to a maximum of +/- 400 g. The on-chip IC connection transforms the deceleration information into a peak-resolution bit stream digitally and is then communicated with great security to a quality microcontroller chip by means of DSI protocol. The advanced algorithms supported in the system analyze the condition and finalizes the ideal time to use the airbag.

ST's novel high-g accelerometers are functional within an extreme thermal conditions ranging from -400C to 1250C. The devise is highly robust to electromagnetic interference and are AEC-Q100 certified, satisfying a significant stress-evaluation approved by the Automotive Electronics Council (AEC) for use in automotive integrated circuits.

The sensing unit of the accelerometer integrated in the airbag is manufactured based on the company’s 8-inch MEMS series, which has already delivered over 850 million motion sensors till recently. The sophisticated integration and unique regulation of parasitic currents in the electrical segments are achieved employing Silicon-On-Insulator technology used in ST’s patented BCD production methodologies.

Source: http://www.st.com

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