PCB Uses Plasma-Therm VERSALINE DSE System in MEMS Sensors

PCB Piezotronics (PCB), pioneer in the architecture and fabrication of force, pressure, acoustic torque, load, strain, and vibration sensors, and ICP technology, has advanced its sensor product series by employing silicon-based technology for manufacturing various MEMS devices.

The advancement and fabrication of these sensing devices are based on a Plasma-Therm VERSALINE DSE system that have been used in numerous crucial deep silicon etching manufacture process.

The company’s MEMS-oriented sensing devices covers a wide range of shock accelerometers used in industrial monitoring applications including pile driving, load vibration, and hole drilling. These products have also wide applications in aerospace and defense areas.

The advancement of a complicated silicon-on-insulator (SOI) MEMS system delivers miniature, precise and long-lasting shock accelerometers. The company opted for low notch Plasma-Therm’s etch technology for its MEMS processes-based methodology.

According to Andrea Tombros, PCB’s senior MEMS design engineer, this system has been a vital component towards the advancement of their MEMS solutions and the profound experience of Plasma-Therm has helped them in developing this innovative product.

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