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Freescale Technology Forum: Silex Releases Ultra-Low-Power, Dual-Band 802.11 a/b/g/n Wi-Fi Module

Freescale Technology Forum - Silex Technology America, Inc., a global leader in wired and wireless networking solutions, today at the Freescale Technology Forum in Tokyo announced the release of the Silex Technology SX-ULPAN, an ultra-low-power, dual-band 802.11 a/b/g/n Wi-Fi module with industrial temperature support. The SX-ULPAN provides the needed reliable connectivity for networking applications based on Freescale Kinetis MCUs.

"The addition of Silex Technology's SX-ULPAN Wi-Fi solution to the growing portfolio of development boards compatible with Freescale's modular Tower™ System evaluation platform makes the creation of devices for the Internet of Things simpler," said Steve Nelson, executive director of IoT at Freescale. "With this module, Silex brings 802.11n Wi-Fi connectivity into a seamless hardware development platform with Kinetis MCUs, and provides exceptional support for customers looking to get to market quickly with connected solutions for the IoT."

Founded on world-class expertise and support from Silex Technology, and powered by the Qualcomm Atheros 4004 intelligent networking platform, the new solder-down module connects a device to the Internet of Things, providing a seamless, reliable connectivity experience the end user.

"The SX-ULPAN's dual-band connectivity and industrial temperature support make the SX-ULPAN a perfect module for device manufacturers looking to add reliable Wi-Fi connectivity to their products," said Keith Sugawara, vice president of business development at Silex America. "Our Wi-Fi development board is compatible with the Freescale Tower System development board platform and includes MQX driver support, making the SX-ULPAN easy to evaluate and integrate into products using Kinetis MCUs based on ARM® Cortex®-M4 cores."

With the release of the SX-ULPAN, Silex also continues a successful partnership with Freescale beyond the i.MX 6 processors, now adding reliable Wi-Fi connectivity for Kinetis MCUs designed for Internet of Things (IoT) market.

SX-ULPAN will find its way into many IoT applications like remote equipment monitoring, asset tracking and telemetry, security, wireless audio, Industrial sensors and controls, home automation, medical devices and others. Engineering samples and production quantities of the SX-ULPAN are now available, along with a development kit for the SX-ULPAN.

Additional Features

  • IEEE 802.11a/b/g/n-compliant dual-band Wi-Fi radio (2.4/5 GHz)
  • Single Stream System (1x1), 20 MHz
  • On-Board U.FL connector / Antenna, Surface Mount Module
  • IPv4 / iPv6, TCP and UDP protocol supported on chip, offloading the host controller
  • Wi-Fi Protected Setup Support
  • Compatible with Freescale Tower System development board platform with MQX RTOS driver support


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