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SWINDON Silicon Systems Showcase ASIC, SoC and SiP Technology and Demonstrate how they are at the Heart of Intelligent Sensing at Sensor + Test 2017

On Stand 334 in Hall 5 at the Sensor + Test exhibition in Nurnberg, SWINDON Silicon Systems, a Sensata Technologies company, will be showcasing the advantages of Application Specific Integrated Circuits (ASIC), System on Chip (SoC) and System in Package (SiP) solutions that are at the heart of intelligent sensing for emerging technologies, as well more established markets such as automotive and industrial.

As more companies are realising the many advantages these single package electronic systems can offer, SWINDON, already renowned for its design expertise and experience in the supply of mixed signal ASICs, will be at the show to share its experience and help customers choose the right solution for their particular applications.

SWINDON has recently signed a strategic agreement with Dukosi, a battery management technology innovator, to bring its disruptive semiconductor chip based battery management solution to market. This latest contract win for SWINDON proves once again that it is at the forefront of innovation and is fast becoming the first choice for companies looking for an ASIC partner that will work with them from concept to volume supply.

Members of the SWINDON team will be on hand to highlight the advantages of mixed signal ASIC / MEMS, SoC and SiP technology for existing and emerging markets and provide an insight into SWINDON’s full turnkey semiconductor service delivering optimized solutions that provide the competitive edge, both technically and commercially.

Visitors to the booth will discover how SWINDON’s renowned integrated ASIC, SoC and SiP and MEMS custom sensor solutions are at the heart of intelligent sensing today and in future emerging techologies.

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