Posted in | News | Light / Image Sensor

Sony's Time-of-Flight Image Sensor Features 10-µm Pixel Pitch

Sony Corporation ("Sony") today announced it has developed a back-illuminated time-of-flight ("ToF") image sensor with a 10µm pixel pitch, the industry's smallest.*1

Comparison of obtained depth map at the same distance: New sensor (left) and conventional sensor (right) (Credit: SONY)

This accomplishment was made possibly combining the ToF image sensor technology of Softkinetic Systems S.A. ("Softkinetic"), a Sony subsidiary acquired in 2015, and Sony's back-illuminated CMOS image sensor technology. Research results on the sensor were made public at the "2017 Symposia on VLSI Technology and Circuits" on Monday, June 5, 2017 in Kyoto, Japan.

*1 Back-illuminated ToF image sensors, as of June 5, 2017, the date of this release.

*2 Compared to Sony's front-illuminated ToF image sensor.

With ToF technology, the distance to an object is measured by the time it takes for light from a light source to reach the object and reflect back to the sensor. ToF image sensors detect distance information for every pixel, resulting in highly accurate depth maps. Accuracy can be enhanced even further by ensuring that the reflected light is efficiently received and that the processing required to measure distance is executed at a high frame rate. Additionally, power consumption can be reduced by efficiently collecting and processing the reflected light; the more efficient, the less light source power is needed.

At the heart of the ToF technology in Sony's new product is Softkinetic's proprietary Current Assisted Photonic Demodulator ("CAPD"), which employs a unique pixel architecture capable of high-speed modulation using drift current*3 in the pixel, allowing for detection of the light signal with an improved accuracy. This methodology raises the accuracy of distance measurement at the level of every pixel, thereby delivering accurate measurement and depth map acquisition even at significant distances.

Sony combined CAPD with its back-illuminated CMOS image sensor pixel technology to develop the new back-illuminated ToF image sensor, which features a 10µm pixel pitch, with the industry's smallest.*1 The new sensor builds on the advantages of a back-illuminated pixel structure, which layers the circuitry beneath the photo detector. By optimizing the pixel construction and circuitry for CAPD, the new Sony product delivers improved light collection efficiency and enables high-speed distance measurement processing. The design delivers accuracy equivalent to conventional methods, even at 1.5x the distance.*2 The higher level of light collection efficiency also makes it possible to use a less-powerful light source, and this keeps power consumption down and allows the ToF camera module to be more compact.

In recent years, demand for more accurate depth sensing has been increasing, particularly in the fields of augmented reality (AR), virtual reality (VR), and other applications such as robotics and drones that require autonomous operations. This new sensor is part of the DepthSense® lineup, which makes features such as gesture and object recognition as well as obstacle detection possible. By delivering highly accurate depth-sensing performance in a compact package with low power consumption, the new sensor will help expand the range of applications for ToF image sensors.

*3 Internal pixel drift current: Unlike normal image sensors, this current is generated by the potential difference between two electrodes without forming a depletion layer.

Product Features

CAPD pixel technology achieves high-efficiency signal output

SoftKinetic's CAPD method reads signals at differing phases utilizing light source flight time, multiple times, and then outputs the signal ratio to convert to the distance. Generally, in order to increase the depth map's signal-to-noise ratio (SNR), it is necessary to place multiple readout circuits inside the pixel to read multiple signals at different phases accurately so that the delay of reflected light can be calculated precisely, as well as to improve the usage efficiency of the reflected light signal. Depth measurement accuracy also depends on the capacity to use a faster modulation frequency.

To satisfy all of these requirements, CAPD dynamically creates a potential gradient (slope for electron transfer) and performs high-speed transfer via internal pixel drift current.*3 This design ensures efficient, high-speed transfer of electrons converted from reflected light in the photo detector between two collectors, making it possible to obtain signals of different phases more accurately.

* The depth accuracy is governed by the relationship shown in the following equation.
imgage: equation
σdepth: Variation of measured distance, Fmod: Modulation frequency, Cmod: Signal distribution contrast ratio

Highly accurate back-illuminated ToF image sensor with a 10µm pixel pitch, the industry's smallest*1

ToF pixels generally contain multiple readout circuits inside the pixel, so the multiple transistors and circuitry on top of the photo detector (photodiode) in a front-illuminated CMOS image sensor interfere with reflected light from the object, which brings down distance measurement accuracy.

Sony applied back-illuminated CMOS image sensor pixel technology to improve the effective pixel aperture ratio. This design made the light collection efficiency equivalent to that of a 15µm pixel pitch front-illuminated sensor, but using a back-illuminated sensor with a 10µm pixel pitch. The result is a more compact sensor with more accurate depth-sensing performance. The higher light collection efficiency also made it possible to use a less-power light source, and this kept power consumption down and allowed the sensor module to be even more compact.

In addition, accompanying the adoption of the back-illuminated configuration, the pixel construction and in-pixel circuitry layout were optimized for a ToF sensor, making it possible to accelerate the detection of phase difference required for distance measurement. This made it possible to double the modulation frequency (100 MHz) compared to the conventional method*2 while maintaining the usage efficiency of reflected light, thereby obtaining a better depth map with improved accuracy*2 when measured at the same distance. This in turn provides a depth map just as accurate as conventional methods*2 up to 1.5x further away.

Key Specifications

New sensor Conventional sensor
Light source wavelength 850nm 850nm
Pixel size 10µm×10µm 15µm×15µm
Modulation frequency 100MHz 50MHz
Modulation contrast 0.85 0.6
Integration time 380µs 380µs
Depth accuracy at 1 m 5.9mm 12.9mm

* DepthSense is a registered trademark of Softkinetic Systems S.A.


Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Sony Corporation of America. (2019, February 27). Sony's Time-of-Flight Image Sensor Features 10-µm Pixel Pitch. AZoSensors. Retrieved on May 24, 2024 from

  • MLA

    Sony Corporation of America. "Sony's Time-of-Flight Image Sensor Features 10-µm Pixel Pitch". AZoSensors. 24 May 2024. <>.

  • Chicago

    Sony Corporation of America. "Sony's Time-of-Flight Image Sensor Features 10-µm Pixel Pitch". AZoSensors. (accessed May 24, 2024).

  • Harvard

    Sony Corporation of America. 2019. Sony's Time-of-Flight Image Sensor Features 10-µm Pixel Pitch. AZoSensors, viewed 24 May 2024,

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.