New SELECT Technology Aids Selective Plasma Treatment

SUSS MicroTec, a leading provider of process products and devices for the semiconductor sectors and its related markets, and Fraunhofer IST Institute for Surface Engineering and Thin Films, jointly declared the release of SELECT, a bond aligner and mask aligner technology that specifically stimulates wafer parts surfaces using plasma.

The basic treatment of the wafer surface, preceding its wafer processing, will substitute the standard processing methods and helps lowering the entire expenses per wafer. The plasma stimulation can be selectively performed for numerous optical, MEMS and solar purposes utilizing surface modification or direct wafer bonding for the generation of micro valves, sensors, micro mirror arrays or micro fluidic channels. The SELECT toolkit available is an updated version of the company’s MA/BA8 Gen3.

The patent awaiting Fraunhofer IST technology is built on the basis of selective alteration of the molecular surface by atmospheric pressure plasma. The traditional surface treatment of the entire wafers without specific selection process will adversely affect the working of electronics or micro components. By this selective treatment approach, sensitive zones can be shielded by stimulating the specific wafer. Such selective plasma stimulation is utilized with planar wafers and with the topography wafers, where the plasma stimulation is supported on elevated structures or in the cavities.

According to Prof. Dr. Günter Bräuer, director at the Fraunhofer IST, apart from lowering the post-bond annealing heat from 1000°C to 200°C in wafer bonding applications with  selective plasma treatment, it also shields the sensitive structures and thus provides direct bonding by the enhancement of a process window. He added that with the advent of SUSS SELECT toolkit for direct bonding and other wafer processing purposes, excellent device processing can be achieved in the semiconductor industry.

Frank Averdung, President and CEO of SUSS, stated that this process offers high-performance and is highly economical and can be deployed for various applications.


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