Reverse Costing Analysis of STMicroelectronics LSM303D 6-axis Electronic Compass from System Plus

Research and Markets has announced the addition of the "STMicroelectronics LSM303D 6-axis electronic compass - Reverse Costing Analysis" report to their offering.

System Plus Consulting is proud to publish the reverse costing report of the new 6-Axis electronic compass supplied by STMicroelectronics.

The LSM303D is a system-in-package featuring a 3-axis magnetometer and a 3-axis accelerometer. With a 3x3x1mm package size, it belongs to the smallest eCompasses for consumer applications.

The 3-Axis accelerometer uses the TSV process of ST in order to remove the area reserved for I/O pads. The magnetometer dies use the latest process of Honeywell.

The LSM330D is targeted for consumer applications: Tilt compensated compass, Map rotation, Position detection It provides accurate output across full-scale ranges up to ±16g (linear acceleration) and ±12 Gauss (magnetic field).

This report provides complete tear-down of the 6-Axis electronic compass with:

  • Detailed photos
  • Material analysis
  • Schematic assembly description
  • Manufacturing Process Flow
  • In-depth economical analysis
  • Manufacturing cost breakdown
  • Selling price estimation

Key Topics Covered:

Overview / Introduction

  • Executive Summary
  • Reverse Costing Methodology

Company Profiles

Physical Analysis

  • Package X-Ray
  • Package Opening
  • Package Cross-Section
  • ASIC Dimensions
  • ASIC Delayering
  • ASIC Cross-Section
  • MEMS Accelerometer Dimensions
  • MEMS Accelerometer Cap Opening
  • MEMS Accelerometer Sensing Area
  • MEMS Accelerometer Cross-section
  • X/Y-Axis Magnetometer Dimensions
  • X/Y-Axis Magnetometer Delayering
  • X/Y-Axis Magnetometer Cross-section
  • Z-Axis Magnetometer Dimensions
  • Z-Axis Magnetometer Delayering
  • Z-Axis Magnetometer Cross-section

Manufacturing Process Flow

  • Front-End Manufacturing Process Flows
  • Description of the Wafers Fabrication Units
  • Back-End Packaging Process Flow
  • Back-End Packaging Assembly Unit

Cost Analysis

  • Yields Hypotheses
  • ASIC Wafer Cost
  • ASIC Die Cost
  • MEMS Accelerometer Wafer Cost
  • MEMS Accelerometer Die Cost
  • X/Y-Axis Magnetometer Wafer Cost
  • X/Y-Axis Magnetometer Die Cost
  • Z-Axis Magnetometer Wafer Cost
  • Z-Axis Magnetometer Die Cost
  • Back-End: Packaging Cost
  • Back-End: Final test & Calibration Cost
  • LSM303D Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis

  • Manufacturer Financial Ratios
  • LSM303D Estimated Selling Price

For more information visit http://www.researchandmarkets.com/research/sl83ms/stmicroelectronics

Source: http://www.researchandmarkets.com/

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Submit