Molex, LLC, which expanded its printed electronics portfolio by acquiring certain assets of Minnesota-based Soligie, Inc., will be exhibiting at the 2016 FLEX Conference & Exhibition, to be held February 29 to March 3 at the Monterey (CA) Marriott Hotel.
Molex will be exploring key customer applications and requirements at the show, which will focus on the theme of “Building the Innovation Ecosystem for Flexible Electronics.” Soligie® solutions provide a thin, flexible, robust and economical alternative to rigid printed circuit boards (PCBs) or copper flex circuits in a range of applications in the medical, industrial, consumer, defense, and other industries.
“Smart sensor products start with smart manufacturing,” said Mark Litecky, printed electronics marketing manager, Molex. “Electronic packaging form factor is changing, becoming thin and flexible while growing in complexity. Customers are demanding highly functional and cost-effective circuitry. At 2016 FLEX, we will demonstrate the range of Molex capabilities, from the early stage development of printed electronic solutions through the path to high-volume manufacturing.”
John Heitzinger, general manager, printed electronics, Molex, will present on FHE Manufacturing in a session to be held from 1:40 PM to 3:30 PM on Wednesday, March 2. He will be discussing “Flexible Hybrid Electronics for Commercial and Military Applications.”
Soligie sensor solutions are ideal for measuring temperature, shock and humidity, providing physiological, environmental and biochemical monitoring, and virtually any other sensor application requiring a thin, flexible electronic form factor. Soligie designs start with a flexible substrate onto which functional circuits are printed and components are added. Suitable for integrating sensors, batteries, RFID devices, thin displays, LEDs and other passive devices, the Soligie manufacturing processes yield small, flexible, integrated sensor solutions at a lower overall cost than conventional circuitry.