Standex-Meder Electronics, a global manufacturer of reed switches, sensors, relays and magnetics, announces the availability of a complete portfolio of custom power and current sense transformers and components that help HVAC/R equipment designers gain a competitive edge in the marketplace.
The new ML3 Soil Moisture and Temperature sensor represents the latest step in the evolution of Delta-T Devices ThetaProbe series - offering extra features, improved performance and a new look, without any price increase over its predecessor.
The robust and reliable spectro-radiometer MK-350 was conceived by UPRtek as a cost-effective, mobile precision tool to measure, analyze and store the most important photometric parameters in the specification and qualification of LED, OLED and EL lamps and other luminaries.
Along with its displacement, pressure, velocity and angle sensors, burster provides an exciting line of torque sensors to measure the drag torque of motors and pumps, static and dynamic torques and mechanical power, to record bio mechanical movements in medical engineering and utilize in screwing technology.
Touchstone Semiconductor Introduces the Industry’s Only 0.8V to 5.5V, Rail-to-Rail Single Op Amps in SC70.
Following on from Peratech's announcement about its work on QTC™ inks for printing pressure sensitive sensors and switches, the company has announced that a paper on the subject is available on the Institute of Physics website.
SKF launches SKF Insight™, a groundbreaking innovation in intelligent wireless technologies that are integrated into SKF bearings.
The Space Engineering Research Center (SERC) delivered an innovative star field simulator to technical personnel at NASA’s Marshall Space Flight Center (MSFC) in Huntsville, Ala., in March.
Syncronys International is pleased to announce its subsidiary Seeker Technologies Ltd. (www.Seeker-Tec.com) signs additional sensor agreement.
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has begun working with research partners to develop a pilot line for next-generation MEMS devices augmented with advanced technologies such as piezoelectric or magnetic materials and 3D packaging.