Mar 12 2013
Advances in chip technology, the benefits brought by the latest manufacturing tools and insights into market trends all featured at CS International Conference.
Around 300peoplerecently flocked to Frankfurt, Germany, for the 3rd CS International, the highly successful successor to CS Europe.
Attendees at this premier international event for the compound semiconductor community heard insights into the latest chip technologies, peruseda comprehensive exhibition and made and renewed contacts in this industry.
One of the biggest highlights of the meeting was the day-one keynote talk by Wilman Tsai, Intel’s Program Manager of Technology Manufacturing Group. Tsai detailed the tremendous breadth of III-V-on-silicon work that this chipmaker is performing in partnership with internationally renowned institutions and universities to maintain the march of Moore’s Law throughout this decade and beyond.
Yifeng Wu, Vice President of Product Development at west-coast power electronics developer Transform, provided the day-two keynote. He revealed the start-up’sswitch from SiC to silicon substrates, and its plans to launch GaN-on-silicon transistors by the end of this year.
GaN-on-silicon development was a hot topic at the event, with Dow Corning, EpiGaN and Azzurro all detailing their epiwafer capabilities.
More details of the conference presentations, including a leading analyst’s take on Qualcomm’s development of a silicon CMOS power amplifier process, will be provided in the April&May edition of Compound Semiconductor magazine.www.compoundsemiconductor.net
Source: http://www.cs-international.net/