CEA-Leti will kick off its participation in IEDM 2013 in Washington, D.C., on Dec. 8th with a workshop for invited guests on key technologies for future applications in the chip industry.
A networking event will follow the workshop.
In addition to short presentations on Leti’s latest results in the selected topics, the workshop will include a summary of Leti’s technology roadmap for the next 10 years.
Topics for the event include:
Lithography cost-effective solutions for 1X nodes
3D: dream and reality
High-performance, reliable resistive memories embedded in advanced logic CMOS technologies
M&NEMS platforms: an enabler for the next generation of sensors in consumer electronics
CMOS technologies: our most power-efficient solution today and our vision toward the 10nm node and beyond.
Discussions, networking and cocktails will follow the presentations.
Committed to developing disruptive technologies for its industrial partners, Leti plans 10-15 years ahead to provide solutions that will meet future demands for technology in a variety of domains.
At this year’s conference, Leti, which pioneered FDSOI technology in the early 1990s and helped demonstrate its power-efficiency superiority, will present its recent results through various papers (including two invited ones) focused on next-generation CMOS and memory components.
By creating innovation and transferring it to industry, Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 startups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo.