The new FPC1291 is a single-chip, single-die sensor eliminating the need for a companion chip and is considered to have more benefits than a dual-chip solution. This third-generation sensor provides enhanced performance while simplifying the OEM design process as well as supporting easy hardware integration designed for applications such as smartphones.
The FPC1291 sensor features world-leading biometric performance and is convenient to use. Design possibilities are high as the sensor comes in various variations and is suitable for all kinds of top layers such as glass and ceramic coating.
We are very proud to launch the third generation of fingerprint sensors, starting with FPC1291. It will not only have better biometric performance in everyday use cases but also in tougher conditions as the new technology handles distortion like common mode noise better than ever before.
Pontus Jägemalm, Senior VP Research & Development and CTO at Fingerprints
The FPC1291 has been extensively tested as well as verified, and prototypes are available for smartphone manufacturers, partnering with top module manufacturers. The latest sensor is expected to get full qualification in the first quarter of 2018.