SICK has introduced a new high performance sensor called the W9-3 photoelectric sensor. The device has a rugged plastic housing and is available in a wide range of options such as connectivity, mounting and sensing range. It is suitable for a number of applications.
For instance, the sensor can be used for tracing bright and multicolored objects in food processing and material handling industries.
W9-3 photoelectric sensor
The sensor, with a slotted through-hole design, has various mounting options and can be mounted from 5.2 13.7 mm and 18.9 to 27.4 mm. These mounting options ensure that the W9-3 sensor can be mounted in a variety of configurations.
A unique plastic and molding technique is adopted to develop the sensor, ensuring that the end product is strong and rugged. A VISTAL material, which is nine times stronger than the conventional ABS material, is used during the development process. The connector of the sensor is over-molded onto the systems to produce a sturdy sensor. The device utilizes custom ASIC that features an OES3 technology to deliver excellent background suppression at long distances.
The OES3 technology allows the sensor to offer a high level of immunity to ambient light and overlook background reflections.
SICK specializes in developing automatic identification, machine vision, sensors and safety systems for logistics automation.
Source: http://www.sick.com/