TowerJazz has introduced a hybrid CMOS image sensor (CIS) process, TS11IS. Using this process, customers can produce superior sensors with more resolution, improved performance and lesser pixels.
The TS11IS contains both 0.11um and 0.16um platforms together. The 0.11um platform provides pushed designing regulations for the pixel arrays, while the 0.16um platform offers CMOS for peripheral circuits. The process can be applied in security sensors, high end photography, 3D imaging and machine vision.
The TS11IS platform with the shrink process of CMOS enables the re-use of 0.18um circuit IP. Hence, redesigning cost of existing blocks can be saved and the first time success rate is also higher. The platform provides lesser pixel pitch, enhanced pixel functions, angular response and sensitivity. It enables around 50% decrease in the pixel size of the superior global shutter pixels. It has a novel local interconnect layer that permits intense routing for metallization in the pixels while the quantum efficiency is maintained. The platform has firm designing rules for implant and metal layers. The angular response of the sensor can be enhanced by lowering the stack height, which can be done by a "Bathtub" option offered in the platform.
CMOS Image Sensors’ Marketing Director, Jonathan Gendler stated that the smaller pixels provide more resolution and improved pixel functions, which are ideal for customers’ requirements for the CIS market sector. Customers can develop their business, extend their design applications, and broaden their share in the market. The company’s customers have given positive feedback on the platform, which allows them to re-use their design block IP and reduce the die and pixel array size. The novel platform reduces the cost as well as improves the functions of the device.
Source: http://www.towerjazz.com/