Mattson Technology, Inc., a leading supplier of advanced semiconductor processing equipment, today announced it has received a follow-on order for multiple paradigmE etch systems from a major CMOS image sensor (CIS) manufacturer. The systems will support a volume production ramp of CIS devices produced at this customer's fabrication facility.
UniPixel, Inc., a provider of Performance Engineered Films to the touch screen, flexible printed electronics, and lighting and display markets, has joined forces with a manufacturer of personal computers to develop and introduce products that feature next-generation touch screens based on UniPixel's UniBoss™ pro-cap, multi-touch sensor film.
A team of astronomers led by the University of Leicester has uncovered new evidence that suggests that X-ray detectors in space could be the first to witness new supernovae that signal the death of massive stars.
Validity Sensors, Inc., the leader in Natural ID™ authentication, today announced that Intel Capital has completed a strategic investment as part of its Series E Financing.
Integrated Biometrics, LLC (IB) today announces another technological breakthrough with the FBI certification of its newest finger print technology. IB's development team created the new product using their patented Light Emitting Sensor (LES) technology along with a thin film transistor (TFT). LES technology utilizes a highly engineered charged polymer film interacting with the specific properties of human skin to luminesce fingerprint images.
In a breakthrough for high-definition (HD) network video surveillance, NXP Semiconductors N.V. today announced its Advanced ASC884xA and ASC885xA series of single-chip video processors for HD IP security cameras. These devices integrate virtually all functions required for an IP camera design – from raw image sensor data input, image signal processing (ISP), and H.264 compression, to secure encrypted transmission over the network through a Gigabit Ethernet interface.
ams, has announced that two of its products have been selected as EDN’s “Hot 100 Products for 2012“. The award-winning AS3935 Franklin Sensor IC and the innovative AS3421/3422 ANC (active noise cancellation) ICs have been selected for the “Sensors” and “Microcontrollers and Processors” categories, respectively.
Leading semiconductor test equipment supplier Advantest Corporation has introduced the IC industry's fastest image-capture module to cost-efficiently test the high-frequency, low-power D-PHY and M-PHY interface chips expected to drive growth in the image sensor market. The new T2000 3Gbps CMOS Image Capture Module operates on Advantest's T2000 ISS system, an industry-leading test platform for a broad range of system-on-chip (SoC) devices.
MU9 series industrial cameras offer high-quality monochrome and color 5 Mpix CMOS sensors, USB 2.0 interface, and APIs for more than 30 leading image processing libraries in both subminiature board-level and enclosed camera configurations.
Toshiba America Electronic Components, Inc. (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, announced a new 13 mega pixel, 1.12 micrometer, CMOS image sensor delivering high-image quality equivalent to a 1.4 micrometer pixel image sensor.
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