Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced its newest 12 megapixel (Mp) image sensor for smartphones, which will elevate the quality of mobile phone pictures.
Sensuron, a global provider of compact fiber optic sensing (FOS) systems, today announced the launch of Summit, the first fiber optic sensing platform to provide fully distributed sensing with the ability to combine multiple measurement technologies into a single platform. With comprehensive and real-time access to data, engineers are more readily equipped to detect design flaws earlier – saving resources, increasing efficiencies and preventing costly failures after a product has launched.
Integrated Device Technology, Inc.® (IDT®) today introduced an optical sensor that accurately detects UVB and ambient light. Like the recently announced ZOPT2202, the two-channel ZOPT2201 offers new health and wellness capabilities for wearables and other mobile technology, but also features the ability to measure light for screen controls.
CyberOptics Corporation®, a leading global developer and manufacturer of high precision sensing solutions, today announced an OEM supplier agreement with Nordson YESTECH® (Nasdaq: NDSN) to supply its proprietary 3D Multi-Reflection Suppression (MRS) sensors. Nordson will incorporate CyberOptics’ advanced 3D MRS technology that inhibits measurement distortions, into their new 3D FX-940 Ultra Automated Optical Inspection (AOI) systems launching at IPC APEX Expo on March 15-17th in Las Vegas.
Ushio America, Inc. (HQ: Cypress, California, President & CEO, Shinji Kameda), a wholly owned subsidiary of Ushio Inc. (HQ: Tokyo, President and CEO: Kenji Hamashima), today announced that the company will start offering the super-affordable, palm-top photo absorption sensor (PAS), PiCOEXPLORER™, manufactured by Ushio Inc., in the US on April 1, 2016. (Shipment of the product will be scheduled in late July 2016).
Image processing tools can improve our ability to monitor the soundness of infrastructure like bridges and gas pipelines. They increase the precision of optical-fiber measurements by a factor of 100.
Vishay Intertechnology, Inc. is broadening its optoelectronics portfolio with the introduction of six new Automotive Grade, high-speed silicon PIN photodiodes that feature excellent photoresponse linearity for small signal detection. Available in three low-profile, surface-mount packages, devices in the Vishay Semiconductors VEMDxx60X01 family offer fast response times; sensitive areas of 0.23 mm², 0.85 mm², and 7.5 mm²; and high reverse light current to 38 µA for automotive and industrial applications.
ON Semiconductor, driving energy efficiency innovations, introduces another major advance in image sensing technology with the AR0135 global shutter CMOS image sensor.
InvenSense, Inc.,, a leading provider of MEMS sensor platform solutions, announces a breakthrough mainboard optical image stabilization (OIS) solution with its ICG-20660L, a 6-axis (3-axis accelerometer + 3-axis gyroscope) integrated MEMS motion sensor optimized to support optical image stabilization, as well as a newly developed technology for macro image stabilization (OIS-Macro).
OmniVision Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the latest addition to its lineup of big-pixel sensors, the OV13870 PureCel®Plus-S image sensor.
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