Texas Instruments (TI) has launched the TMP103 temperature sensor, enclosed in a four-ball wafer chip-scale package (WCSP). The sensor provides a digital output and temperatures up to a resolution of 1 °C can be measured.
The sensor includes a two-wire I2C/SMBUS expanded interface that supports multiple device access (MDA) commands. The MDA instructions enable communication of the master with several TMP103 sensors on the bus at the same time, avoiding the requirement to transmit distinct commands to every TMP103 device on the bus.
Around eight TMP103 sensors can be connected in parallel and can be easily accessed by the host. The TMP103 is exclusively developed for power-responsive and space-restricted applications that demand continuous monitoring of several temperature measurement points.
Source: http://www.ti.com