Dongbu HiTek has commenced mass manufacturing of high dynamic range (HDR) CMOS image sensor (CIS) chips for a Chinese manufacturer, BYD Microelectronics. BYD image sensors would initially focus on door monitoring systems and other security surveillance applications.
With its range of luminance capabilities, these image sensors could accurately process and sample concentration levels ranging from strong sunlight to faint moonlight. This technology is one more addition to the specialized image sensor processing technologies, which have been developed in the foundry of Dongbu HiTek for fabless companies.
This new imaging chip was mainly developed for achieving higher profit margins, with a selling price, which is four times more than the other specialized CIS devices being used in digital cameras and camera phones. These specialized chips are being used for both Endoscope and X-ray systems in the medical field and in other harsh industrial and automotive environments. Dongbu also has plans of adding a 5.0 Megapixel option to its processing portfolio for VGA and 1.3-to-3.0 Megapixel chips. It also plans to use the BCDMOS chips in communications, consumer electronics, industrial and computing applications. At present, Dongbu is sampling chips for applications in the automotive sector.