CyberOptics Corporation, a world leader in intelligent inspection and sensing solutions for electronics assembly and semiconductor process equipment, will unveil the new ReticleSense Airborne Particle Sensor (APSR) at the SEMICON Korea Conference from February 12-14th at Booth # 1403, C Hall, COEX, Seoul, Korea.
With APSR, equipment engineers can wirelessly monitor airborne particles in semiconductor process equipment where reticles are implemented without opening the tool. APSR speeds equipment qualification and release to production, shortens equipment maintenance cycles and lowers equipment expenses. This reticle measurement device is an extension of the wafer-shaped WaferSense Airborne Particle Sensor (APS) that has been in use since 2011.
“As semiconductor fabs continue to focus on improving productivity and streamlining manufacturing processes, CyberOptics continues its commitment to develop and offer unique, innovative measurement devices that improve yields, increase tool uptime and lower costs. Our proven technology has been designed in with major semiconductor equipment OEMs, and is widely in use today at semiconductor fabs worldwide where they are recognizing exponential returns on invested capital,” said Subodh Kulkarni, President and CEO, CyberOptics.
In addition to revealing the new ReticleSense APSR, CyberOptics will also showcase the entire wireless WaferSense measurement devices that provide specialized solutions to improve fab yields and equipment uptime. The wafer-shaped measurement solutions are used in many areas of the fab, including thin film, photo tracks, diffusion, etch, implant, metallization, reticle manufacturing, transport, and automation. “Equipment engineers rely on WaferSense to provide objective, reliable data in real-time, to enable repeatable set-up and streamline fab processes at the same time,” said Mark Hannaford, Director of Sales and Marketing, CyberOptics.
Adopted by the semiconductor industry since 2004, the award-winning WaferSense product line addresses specialized needs related to leveling, with the Auto Leveling Sensor (ALS), gap measurement, with the Auto Gapping Sensor, (AGS), robot teaching, with the Auto Teaching Sensor (ATS), vibration measurement, with the Auto Vibration Sensor (AVS), and airborne particle detection, with the Airborne Particle Sensor (APS). All are available in 200mm, 300mm and 450mm wafer sizes.
Founded in 1984, CyberOptics Corporation is a leading provider of sensors and inspection systems that provide process yield and through-put improvement solutions for the global electronic assembly and semiconductor capital equipment markets. The company is repositioning itself as a developer and manufacturer of high-precision, proprietary 3D sensors for the electronics and general metrology markets. Headquartered in Minneapolis, Minnesota, we conduct worldwide operations through facilities in North America, Asia and Europe.
Statements regarding the Company’s anticipated performance are forward-looking and therefore involve risks and uncertainties, including but not limited to: market conditions in the global SMT and semiconductor capital equipment industries; increasing price competition and price pressure on our product sales, particularly our SMT systems; the level of orders from our OEM customers; the availability of parts required for meeting customer orders; the effect of world events on our sales, the majority of which are from foreign customers; product introductions and pricing by our competitors; the level of revenue and loss we achieve in the remainder of 2013; the level of revenue and profit or loss we achieve in 2014; success of anticipated new OEM and end-user opportunities; and other factors set forth in the Company’s filings with the Securities and Exchange Commission.