The Ashtead Technology stand (No. O72) at the Advanced Engineering Show 2016 (Birmingham NEC 2-3rd November) will feature the latest inspection technologies; providing visitors with one source for all of their equipment rental needs.
Metal processing companies, including steel and aluminium rolling mills, can now source complete, inline precision measurement and inspection systems from a single UK supplier.
Advanced Photonix, recently declared that it has achieved a contract from Concurrent Technologies (CTC) to deliver a terahertz (THz) system for the U.S. Air Force, in response to their demand for precision coating removal on aircraft.
The groundbreaking ceremony for the Richard Desich SMART Commercialization Center for Microsystems at Lorain County Community College took place last Friday. The new 46,000-square-foot building, will focus on the commercialization of sensors and microsystems.
In-process measurement of the thickness of Silicon wafer substrates and blind via depth is a regular operation in semiconductor manufacturing. Armstrong Optical Ltd of Northampton have added high precision, non contact sensor that allows thickness measurement of Silicon (and other semiconductor substrates) wafers (doped or undoped).
Cordex Instruments have designed a sensing system that detects corrosion in pipes that are placed above the ground and carry toxic substances.
A Memorandum of Understanding (MoU) has been signed between QinetiQ and the King Abdulaziz City for Science and Technology (KACST) in Saudi Arabia to collaborate on a range of research and technology development programmes which could include autonomy, robotics, sensors, communications and remote sensing.
Based on the Bytewise Profile360 laser system that measures the geometry of extruded profiles, Crosscheck™ uses a high resolution, two dimensional digital camera sensor and a laser to read a profile surface and provide real-time shape measurements for process control, part inspection, robotic guidance and shape checking.
Tamar Technology acquired orders for Through-Silicon Via (TSV) measurement technology, from two main semiconductor equipment producers. The proprietary Wafer Thickness Sensor (WTS) of Tamar can calculate TSVs etch depth and wafer thickness for single or multiple wafers.
NDC Infrared Engineering Ltd, a web-based calibration system manufacturer for extrusion industry, is releasing three novel thickness measurement systems, the re-modeled NIR sensor FG710S, the extended range TFG710S-ER film system and the OptiMike Shadow LED sensor, at the K’2010 exhibition
Terms
While we only use edited and approved content for Azthena
answers, it may on occasions provide incorrect responses.
Please confirm any data provided with the related suppliers or
authors. We do not provide medical advice, if you search for
medical information you must always consult a medical
professional before acting on any information provided.
Your questions, but not your email details will be shared with
OpenAI and retained for 30 days in accordance with their
privacy principles.
Please do not ask questions that use sensitive or confidential
information.
Read the full Terms & Conditions.