The groundbreaking ceremony for the Richard Desich SMART Commercialization Center for Microsystems at Lorain County Community College took place last Friday. The new 46,000-square-foot building, will focus on the commercialization of sensors and microsystems.
In-process measurement of the thickness of Silicon wafer substrates and blind via depth is a regular operation in semiconductor manufacturing. Armstrong Optical Ltd of Northampton have added high precision, non contact sensor that allows thickness measurement of Silicon (and other semiconductor substrates) wafers (doped or undoped).
Cordex Instruments have designed a sensing system that detects corrosion in pipes that are placed above the ground and carry toxic substances.
A Memorandum of Understanding (MoU) has been signed between QinetiQ and the King Abdulaziz City for Science and Technology (KACST) in Saudi Arabia to collaborate on a range of research and technology development programmes which could include autonomy, robotics, sensors, communications and remote sensing.
Based on the Bytewise Profile360 laser system that measures the geometry of extruded profiles, Crosscheck™ uses a high resolution, two dimensional digital camera sensor and a laser to read a profile surface and provide real-time shape measurements for process control, part inspection, robotic guidance and shape checking.
Tamar Technology acquired orders for Through-Silicon Via (TSV) measurement technology, from two main semiconductor equipment producers. The proprietary Wafer Thickness Sensor (WTS) of Tamar can calculate TSVs etch depth and wafer thickness for single or multiple wafers.
NDC Infrared Engineering Ltd, a web-based calibration system manufacturer for extrusion industry, is releasing three novel thickness measurement systems, the re-modeled NIR sensor FG710S, the extended range TFG710S-ER film system and the OptiMike Shadow LED sensor, at the K’2010 exhibition
Rolls-Royce, the leading provider of power systems, has been assigned to upgrade the National Oceanic and Atmospheric Administration (NOAA) ship Thomas Jefferson which is the Moving Vessel Profiler (MVP™) of the NOAA.
SICK, a trend-setter in the production of sensors, machine vision, safety systems and automatic identification products for Factories and Logistics Automation, has introduced a new array sensor named WL27-3 Reflex
Micro-Epsilon has introduced the latest version of the companyï¿½s optoNCDT 1402 laser sensor.