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Ultra-sensitive Sensor with Gold Nanoparticle Array

Scientists from the University of Bath (UK) and Northwestern University (USA) have developed a new type of sensor platform using a gold nanoparticle array, which is 100 times more sensitive than current similar sensors.

10 Jan 2019

Cree and STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement

Cree, Inc. announces that it signed a multi-year agreement to produce and supply its Wolfspeed® silicon carbide (SiC) wafers to STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications.

From Wolfspeed, Inc. 10 Jan 2019

AAEON Partners with Gorilla Tech to Showcase High-Performance A.I. Computing at CES 2019

AAEON, the leading designers and manufacturers of IoT and A.I. edge computing platforms, and Gorilla Technology Group, the global leader specializing in video intelligence and IoT technology, jointly demonstrated their A.I. (artificial intelligence) computing capability in featured smart transportation solutions at Intel® booth during CES 2019.

From AAEON Technology Inc 10 Jan 2019

Ultra-Precision Gaging Probes Offer Highly Accurate Dimension Measurement for QC, Metrology and Inspection Applications

NewTek Sensor Solutions introduces the MBB Series of Ultra-Precision Dimensional Gaging Probes engineered for highly accurate and repeatable measurement of dimensional parameters in a variety of quality control, industrial metrology, and inspection equipment applications.

From NewTek Sensor Solutions 10 Jan 2019

TDK Announces New Chirp SonicTrack™ Inside-Out 6-DoF Ultrasonic Controller Tracking Solution for All-In-One VR

TDK Corporation expands its Chirp Microsystems ultrasonic product portfolio with Chirp SonicTrack™, an ultrasonic six-degree-of-freedom (6-DoF) controller tracking solution for all-in-one (AIO) virtual reality (VR) systems.

From TDK Corporation 9 Jan 2019

Chirp Microsystems and Qualcomm Technologies, Inc. Collaborate to Bring Inside-Out 6-DoF Controller Tracking to Mobile VR/AR Headsets

TDK Corporation announced it is working with Qualcomm Technologies, Inc. through its group company, Chirp Microsystems, to make inside-out six degree-of-freedom (6-DoF) controller tracking available to mobile VR/AR head-mounted displays (HMDs) powered by Snapdragon Mobile XR Platforms.

9 Jan 2019

TDK Launches Portfolio of Sensors and Technologies Enabling the Next-Generation of All-In-One VR Platforms

TDK Corporation announces today the launch of a complete portfolio of VR sensors enabling a new class of highly accurate and affordable all-in-one VR solutions.

From TDK Corporation 9 Jan 2019

New Pocket-Size Scanning Technology to Test Whether Food Items Have Gone Stale

Ten million metric tons of food is being dumped in the garbage annually in Germany in spite of it still being edible, according to a study by the environmental organization WWF Germany.

4 Jan 2019

FLEX 2019 and MSTC to Highlight SMART MedTech, Transportation and IoT Innovations

Flexible and printed electronics innovations and autonomous mobility sensors will take center stage as more than 700 attendees gather for 120 market and technical presentations, 70 exhibits and four short courses at the co-located FLEX 2019 and MEMS & Sensors Technical Congress (MSTC) in Monterey, California, February 18-21, 2019.

20 Dec 2018

New Graphene-Based Sensor Design for Detecting Pathogens, Gases, and Chemicals

In 2017, over 100 food recalls were issued in the US because of contamination from harmful bacteria such as Listeria, E. coli, or Salmonella.

5 Dec 2018

Sensors General News

Ultra-sensitive Sensor with Gold Nanoparticle Array

Cree and STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement

AAEON Partners with Gorilla Tech to Showcase High-Performance A.I. Computing at CES 2019

Ultra-Precision Gaging Probes Offer Highly Accurate Dimension Measurement for QC, Metrology and Inspection Applications

TDK Announces New Chirp SonicTrack™ Inside-Out 6-DoF Ultrasonic Controller Tracking Solution for All-In-One VR

Chirp Microsystems and Qualcomm Technologies, Inc. Collaborate to Bring Inside-Out 6-DoF Controller Tracking to Mobile VR/AR Headsets

TDK Launches Portfolio of Sensors and Technologies Enabling the Next-Generation of All-In-One VR Platforms

New Pocket-Size Scanning Technology to Test Whether Food Items Have Gone Stale

FLEX 2019 and MSTC to Highlight SMART MedTech, Transportation and IoT Innovations

New Graphene-Based Sensor Design for Detecting Pathogens, Gases, and Chemicals

Alzheimer’s Society on the Role of Sensors in Dementia Innovation

Innovation in CO2 Sensor Technology

Advancing Battery Safety and Electrification: Insights from Sensata Technologies

CMV Combination: Metal Detection, Weight Control and Label Inspection

The LP2 Series Enables Ultra-Low-Pressure Sensing at a Lower Cost

Crydom DPI Series Dual Push-in Connection SSR

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