BLACK+DECKER™ announces its new line of award-winning SMARTECH™ Batteries, which use Bluetooth® Technology to connect to the new BLACK+DECKER Mobile App. The free BLACK+DECKER Mobile App has three components: My Products, Messages, and Projects.
A new highly efficient power amplifier for electronics could help make possible next-generation cell phones, low-cost collision-avoidance radar for cars and lightweight microsatellites for communications.
When measuring the position of moving targets in production and process automation environments, it is important to understand the different methods of sensor triggering, their impact on measurement cycle times and the benefits they can offer over continuous measurement, says Chris Jones, Managing Director at Micro-Epsilon UK.
Northrop Grumman Corporation has successfully completed the Preliminary Design Review (PDR) for the Inertial Sensor Module, a critical component of the U.S. Navy's Inertial Navigation System Replacement (INS-R). The system will be named WSN-12, and will replace the WSN-7.
MEMSIC sensing technology is used in almost every electronic device
The new LL-100 laser level measurement sensor from BinMaster is used for level control, plugged chute detection, and monitoring buildup.
PTC today announced that EPAM Systems, Inc., a leading global provider of product development and software engineering solutions, will combine its extensive engineering and integration capabilities with PTC’s industry-leading ThingWorx® Internet of Things (IoT) platform to build and offer IoT solutions across key verticals, including financial services, life sciences and healthcare, and retail and distribution.
Skkynet Cloud Systems, Inc. (“Skkynet” or “the Company”), a global leader in real-time cloud information systems, announces that its SkkyHub™ cloud service, DataHub® industrial real-time middleware, WebView™ web-based HMI and Embedded Toolkit will be used to provide data connectivity for demos by partners BellChild Ltd., TOA Musendenki Co., Ltd, and Nissin Systems Co., Ltd at the IoT/M2M EXPO of the Japan IT Week exhibition in Tokyo from May 11-13.
Asavie, the provider of next-generation enterprise mobility management and Internet of Things (IoT) connectivity solutions announced today at the Internet of Things World its interoperability with the Firmwave® Edge IoT sensor platform, the first low-power, wireless sensor network platform.
InvenSense, Inc., a leading provider of MEMS sensor platforms, announced the new SensorStudio 2.1 release and the new ICM-30670 FireFly development kit, a sensor prototyping and development platform for Internet of Things (IoT) and drones applications.
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