More than 300 industry experts and thought leaders will gather May 22-23 in Tokyo’s Shinagawa District at the co-located 2019FLEX Japan and MEMS & Sensors Forum for critical insights into the latest flexible hybrid electronics (FHE) technologies and market opportunities. Hosted by FlexTech, a SEMI Strategic Association Partner, the leading FHE exhibition and conference will highlight the latest trends in IoT, Smart Transportation and MedTech in the Japan region. Registration is now open.
Assembling experts from Belgium, France, Japan, South Korea and the United States, the two-day event offers two networking events for innovation, partnership and business opportunities, as well as four technical sessions:
FHE and Printed Electronics
MEMS and Sensors
2019FLEX Japan and MEMS & Sensors Forum Keynotes
Dr. Meyya Meyyappan, Chief Scientist for Exploration Technology at
NASA’s Ames Research Center will offer insights into the latest printed electronics equipment and application developments.
Wilfried Bair, VP of Technology at
NextFlex, will highlight FHE developments at NextFlex.
2019FLEX Japan will feature presentations from industry thought leaders on
Smart Transportation, MedTech and Life Science, and Common Technologies for FHE.
, IBM Japan, ISORG, Shizuoka University, PNI Sensor, Velodyne LiDAR Yole Développement
MedTeck and Life Science
Jenax , , Hiroshima City University, Osaka University, Daiwa House Centexbel
Common Technologies for FHE
, Kitech, Gunma University, DNP Fujitsu Advanced Technologies
2019FLEX Japan will also feature tabletop exhibits by FHE, MEMS and sensors manufacturing supply chain players and electronics companies integrating these technologies.
View the program
To showcase your products and technologies, visit
here or contact SEMI Japan Customer Services at +81.3.3222.5988.