Apr 19 2019
The latest flexible hybrid electronics (FHE) technology, innovations and industry insights will take center stage at FLEX Taiwan, May 29-30, 2019, at the Taipei International Convention Center (TICC). Organized by FlexTech, a SEMI Strategic Association Partner, the one-day technical conference provides insights into market trends, innovative materials, advanced manufacturing technology and FHE application opportunities such as Smart clothing, MedTech and precision sports. Registration for FLEX Taiwan 2019 is now open.
Projected to reach US$77.3 billion by 2029, the global flexible electronics market is expected to be a major growth driver for the microelectronics industry. Powering this rapid growth are key application areas including wearables, robotics, telematics and industrial automation. The lightweight, ultra-thin and foldable features of flexible electronics are inspiring new applications beyond the capabilities of traditional silicon- or glass-based substrates.
Featuring 17 keynote speeches, FLEX Taiwan 2019 brings together leaders across the semiconductor, flat panel display, sensor and other industries. Academics, executives and researchers from leading organizations including Stanford University, Toyobo, Lionrock Batteries, PragmatIC, ITRI, ASE and imec.
For the past 18 years, SEMI and FlexTech have championed the development of the FHE industry through conferences and exhibitions in major microelectronics manufacturing regions such as North America, Europe, Japan, Korea, Singapore and China. FLEX Taiwan provides a powerful platform for connecting with customers and, suppliers, future partners and academia to drive collaboration and uncover new opportunities.
Source: http://www1.semi.org/en/