Leica Microsystems and Sensofar-Tech have have expanded their partnership agreement wherein Sensofar will provide components and technology for an optical system that complements Leica’s industrial applications product portfolio.
The Sensofar technology and Leica’s high-end optical objectives will be used by the company to offer a new and total system for 3D surface metrology and sophisticated optical profiling with a vertical accuracy of 0.1 nm.
The Leica DCM 3D Dual Core 3D Measuring Microscope integrates color imaging, interferometry and confocal microscopy in a single sensor head. This measurement solution is almost maintenance-free since it incorporates confocal microdisplay technology and two LED light sources that do not have moving components. It has Leica’s high-end optics, robust design, and compactness as well as a vertical resolution of 0.1nm and a 17mm vertical screening range.
These features render the device as a strong tool for very precise, ultra fast and non-contact analysis of nano and micro geometries of technical surfaces. It is useful in a broad range of measuring applications in quality assurance and R&D labs as well as automatic online process control.
The collaboration between the two companies originated through a successful pilot project launched during 2008 for the European market. The project attracted a number of interested buyers even in the initial pilot stage who were keen to use the 3D Systems in various applications.