Sensonor Technologies will present some of its developments in the design and fabrication domain at the SPIE Defense, Security, and Sensing (DSS) conference in Orlando, Florida, U.S. on 5 to 9 April 2010.
Currently Sensonor is working on manufacturing uncooled IR sensors for use in thermal imaging cameras.
During the conference, Sensonor’s Senior Engineer Dr. Adriana Lapadatu will deliver a talk titled ‘High-performance long wave infrared bolometer fabricated by wafer bonding’. Lapadatu has revealed that Sensonor is developing a novel microbolometer that has a peak responsitivity feature at the long wave IR range of electromagnetic radiation. Lapadatu has said that the microbolometer consists of a focal plane pixel arrays with a pitch of 25µm based on an IR sensitive material, that is, monocrystalline Si/SiGe quantum wells.
Lapadatu has further explained that a proper selection of several key processes and materials has resulted in the provision of enhanced absorption/transmission properties. Lapadatu has elaborated that these properties, along with the low 1/f noise from the thermistor material and high TCR, will result in increased performance of the microbolometer as compared to existing devices.