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Power Integrations Launches New Family of High-Efficiency, Active-PFC ICs for Offline Applications

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, today introduced HiperPFS-2, a new family of high-efficiency, active-PFC ICs for offline applications from 100 W to 380 W.

HiperPFS-2 ICs combine a boost PFC controller, driver, PFC power MOSFET, PFC diode and protection circuits in one package, enabling exceptionally compact designs ideal for small-form-factor power supplies as used in mini-tower PCs, all-in-one PCs, game console adapters and TVs.

The HiperPFS-2 controller uses a variable-frequency CCM algorithm providing up to 97% efficiency across the load spectrum from 20% to 100% and power factor greater than 0.9 at 20% load with 265 VAC input for designs over 200 W. Including line-connected sense elements, the new device contributes just 60 mW to a typical high-power adapter’s 300 mW no-load budget. Conducted and radiated EMI are minimized due to the integrated soft-recovery diode and short parasitic inductance loop which results from the highly integrated, compact design.

Comments Edward Ong, product marketing manager for Power Integrations: “The HiperPFS-2 device is the most highly integrated PFC solution available. This enables designers to cost-effectively meet the 80 PLUS® Gold and Platinum efficiency standards in space-constrained PCs. The device’s excellent no-load performance simplifies design and reduces cost in high-power adapter applications targeting aggressive standby or no-load specifications.”

Key applications for HiperPFS-2 ICs include TVs, PCs, game console adapters, telecoms and industrial products such as blowers, motor drives and chargers. A new reference design based on the HiperPFS-2 IC, DER-294, describes a 350 W output power boost CCM PFC board with wide range AC input. DER-294 is able to attain > 97% efficiency for 230 VAC across a wide load range and > 0.9 PF at 20% load- see

HiperPFS-2 devices are sampling now in two of Power Integrations’ innovative eSIP-16 packages: the standard eSIP16-D (H package) and the L-bend eSIP16-G (L package) for low-profile applications. Both feature an isolated metal heatsink pad for simple and easy mounting. HiperPFS-2 family devices are priced from $0.959 each in 10K quantities.


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