The latest generation of Infineon's TPMS, the SP37, is a highly integrated TPM sensor which embeds measurement of pressure and radial acceleration (2 DoF) with a low-power microcontroller, a LF receiver and an RF transmitter in a system in package integrating only two dies. This high integration of functions makes it possible to build a complete system with few external components and thus enable system cost savings.
The SP37 is assembled in a Small Outline 14-pin package and operates under a temperature range of -40 to +125°C.
This report will provide a Physical Analysis & Manufacturing Process Flow.
A full reverse costing analysis report is also available, with a complete teardown of the TPMS.
Key Topics Covered:
PHYSICAL ANALYSIS
Physical Analysis Methodology
Package
- Package Views, Dimensions & Marking
- Package X-Ray
- Package Opening
- Package Cross-Section
ASIC Die
- View, Dimensions & Marking
- Delayering
- Main Blocks
- Cross-Section
- Process Characteristics
MEMS Die
- View, Dimensions & Marking
- Bond Pad Opening & Bond Pad
- Cap Removed
- Sensing Area
- Cross-Section:
- Accelerometer Cross-Section
- Pressure Sensor Cross-Section
MANUFACTURING PROCESS FLOW
Global Overview
ASIC Front-End Process
ASIC Wafer Fabrication Unit
MEMS Process Flow
MEMS Wafer Fabrication Unit
Packaging Process Flow & Assembly Unit
For more information visit http://www.researchandmarkets.com/research/jhcm42/infineon_sp37