Oct 7 2014
CyberOptics® Corporation, a world leader in intelligent inspection and sensing solutions for electronics assembly and semiconductor process equipment, will showcase its most efficient and effective wireless measurement devices for chamber gapping, leveling, wafer handoff teaching, vibration and airborne particle measurement, at the upcoming SEMICON Europa, Oct. 7-9, 2014 in Booth #930 at the Alpexpo.
Featured in the booth will be the company’s most advanced airborne particle sensing solutions, which provide a 60% increase in sensitivity, resulting in improved fab yields and equipment uptime.
In addition, on Thursday, October 9, at 13:30 a presentation from Allyn Jackson, Field Application Engineer for CyberOptics, will detail how best to increase efficiency and effectiveness of processes related to airborne particle measurement in reticle mask environments.
“Stringent manufacturing requirements and the need to maximize both yields and tool uptimes requires best-in-class practices for a contamination-free process environment,” said Allyn Jackson, Field Application Engineer. “Quickly identifying when and where airborne particles originate and the source of the contamination is challenging with traditional surface scan wafer methods. Whether for equipment diagnostics, particle qualification or preventative maintenance, equipment engineers need to identify and troubleshoot airborne particle issues efficiently and effectively.”
Engineers can rely on CyberOptics’ ReticleSense™ measurement devices, which are an extension of the proven WaferSense® wafer-shaped Airborne Particle Sensor (APS) devices in use at semiconductor fabs worldwide including the three largest manufacturers where a contamination-free environment is critical. The ReticleSense Airborne Particle Sensor (ASPR) can quickly check the dozens of particle sensitive chambers that otherwise might take long hours or even days to check with multiple surface scan wafers.
Along with the ReticleSense APSR, CyberOptics will also showcase the entire WaferSense product line. This includes its WaferSense wafer-shaped form factor products adopted by the semiconductor industry since 2004 that provide leveling, gap measurement, robot teaching, vibration measurement and airborne particle detection solutions. The WaferSense measurement portfolio including the Auto Leveling System (ALS), the Auto Gapping System (AGS), the Auto Vibration System (AVS), the Auto Teaching System (ATS) and the Airborne Particle Sensor (APS) are available now in 200mm, 300mm and 450mm wafer sizes. Additionally, both APS and ALS are available in 150mm sizes. The ReticleSense Airborne Particle Sensor (APSR) and ReticleSense Auto Leveling System (ALSR) products are available in a reticle shaped form factor.
Source: http://cyberoptics.com/