Posted in | Sensors General

MSIG to Conduct Third Annual MEMS & Sensors Industry Group Conference Asia in China

Recognizing the massive growth potential of MicroElectroMechanical systems (MEMS) and sensors in Internet of Things (IoT) applications, MEMS & Sensors Industry Group (MSIG) will hold its third annual MEMS & Sensors Industry Group® Conference Asia in Shanghai, China on September 13-14, 2016. Held in partnership with Shanghai Industrial Technology Research Institute (SITRI) and co-located with SENSOR CHINA, “The Internet of MEMS and Sensors Today and the Internet of TSensors Tomorrow” is a two-day conference focused on near- and long-term opportunities for MEMS and sensors in the IoT. MSIG and its members will also participate in a two-day exposition at SENSOR CHINA.

Dr. Jian Xu, executive general manager, Shanghai International Autocity Development Co., Ltd., will give a keynote at MEMS & Sensors Industry Group Conference Asia. (MEMS & Sensors Industry Group)

The IoT market is expanding rapidly, presenting huge market opportunities for MEMS and sensors. According to IHS Technology, the IoT market will grow from 15.4 billion devices in 2015 to 75.4 billion in 2025.

That growth has caught the attention of the global MEMS and sensors supply chain: “MEMS and sensors are critical to IoT devices,” said Karen Lightman, executive director, MEMS & Sensors Industry Group. “From smartphones that monitor air quality and agricultural sensors that manage irrigation to smart city applications that monitor structural health, adapt street lights to weather and light conditions, and enable smart roads, MEMS and sensors allow IoT devices to measure, monitor, sense and interact with our always-changing environment.”

Ms. Lightman added, “On September 13, attendees will gain actionable intelligence on the IoT devices of the near future -- those applications that will reach commercialization within the next two to five years. On September 14, they will learn about the IoT devices that will come to market in ten to 20 years. Those speakers will address our TSensors vision -- a transformational movement advocating the use of a trillion sensors to address major world problems -- as they consider longer-term opportunities in the IoT.”

Conference Agenda
Featured presentations currently include:

  • How Cutting-Edge Foundry Process Technologies Drive MEMS Innovation -- Tomas Bauer, senior vice president, sales and business development, Silex Microsystems
  • Improving AIN and ScAIN Thin Film Deposition Technology for Next-Generation PiezoMEMS -- David Butler, vice president, product management and marketing, SPTS Technologies
  • Sensors and IoT Devices in the Age of Voice -- Matt Crowley, CEO, Vesper
  • The Importance of Environment: Air Quality Monitoring by Libelium -- Javier Gabás, key account manager channel sales for Asia, Libelium
  • MEMS Laser Scanning: Platform for Next-Generation 3D Depth Sensors -- Jari Honkanen, director of technical marketing and applications development, MicroVision, Inc.
  • A New Virtuous Cycle for the MEMS Industry -- Claire Troadec, MEMS & semiconductor manufacturing analyst, Yole Développement
  • Implantable MEMS/Sensors and Medical MEMS Packaging Issues for Future Implants -- Dr. Wei-Shan Wang, senior scientist, Fraunhofer ENAS
  • A Fresher Look at the IoT -- Neil Zhao, Asia MEMS/sensors marketing and applications manager, Analog Devices

Additional featured speakers include:

  • Masayuki Abe, manager, Corporate Production Technology, Asahi Kasei Corporation
  • Dr. Janusz Bryzek, CEO, eXo Systems, Inc., and founder, TSensors
  • Ahmed Busnaina, professor & director, NSF Center, Northeastern University
  • Susumu Kaminaga, executive senior advisor, SPP Technologies Co., Ltd.
  • Karen Lightman, executive director, MEMS & Sensors Industry Group
  • Ryoma Miyake, Process Development Group, Silicon Sensing Products, Ltd.
  • Keynote Speaker Tomy Runne, senior manager of planning and promotion department, Sensor Product Division, Murata Manufacturing Co., Ltd.
  • Keynote Speaker Dr. Jian Xu, executive general manager, Shanghai International Autocity Development Co., Ltd.

Panel
Context Computing -- panel moderated by Leopold Beer, regional president AP, Bosch Sensortec, with panelists:

  • Xianfeng (Sean) Ding, director of sensing, Huawei Technologies
  • Ruizhen Liu, Shanghai Academy of Artificial Intelligence
  • Yang (Richard) Shi, industry strategy expert, Huawei Technologies

MSIG Pavilion at SENSOR CHINA
MSIG and a selection of its member companies will exhibit in the MSIG Pavilion, September 12-14 at SENSOR CHINA.

About MEMS & Sensors Industry Group Conference Asia
MEMS & Sensors Industry Group Conference Asia attracts product managers, business development professionals, and product/engineering managers from the MEMS and sensors supply chain, including integrators, device manufacturers, foundries, equipment and material suppliers, researchers, developers and end-users. The majority of the audience is from Asia, with additional attendees from Europe and North America representing multinational corporations.

Premier sponsors of MEMS & Sensors Industry Group Conference Asia include: Platinum Sponsor EV Group; Gold Sponsor SPTS Technologies; Silver Sponsor NXP; and Bronze Sponsors Analog Devices, Applied Materials, Innovative Micro Technology (IMT), OMRON, ULVAC and X-Fab MEMS Foundry.

Event sponsors include: IHS, IVAM, MEMS Journal, Oxford Instruments, PNI Sensor, Semico Research, SENSOR CHINA, Shanghai Industrial Technology Research Institute (SITRI), UNISEM and Yole Développement.

MEMS & Sensors Industry Group Conference Asia will take place September 13-14, 2016 at SENSOR CHINA Expo & Conference Center Address: 3F, Building 2, No. 100 Qinzhou Road, Xuhui District, Shanghai, China. For more information, please contact MSIG via phone: +412/390-1644, email: [email protected] or visit MEMS & Sensors Industry Group Conference Asia at: http://msigevents.org/asia-2016/

For conference registration, please visit: http://msigevents.org/asia-2016/registration

Source: http://www.memsindustrygroup.org/

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