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2012 Image Sensors Conference to Showcase Latest Developments in 3D Imaging Technology

The 2012 Image Sensors conference being held in London from 20 to 22 March will showcase latest technological developments including 3D cinematic applications, gesture control, non-visible spectrum applications and orthophoto production.

The keynote presentation will be delivered by Dr. Eric R. Fossum from the Thayer School of Engineering at Dartmouth, Dr. Nobukazu Teranishi from Panasonic, Dr. Samuel Harvey Moseley from NASA, and Mats Wernersson from Sony Ericsson.

A pre-conference workshop will be led by Dr. David Stoppa from the Italy-based research agency Fondazione Bruno Kessler on the topic “Sensors Architectures for 3D Time-of-Flight Imaging.” Dr. Stoppa stated that the developments in 3D cameras open several opportunities for improvements in ambient-assisted living, cultural heritage preservation, security and surveillance, automotive and industrial control.

The latest trends in gesture recognition technology will be discussed by the Chief Technology Officer of SoftKinetic, Daniël Van Nieuwenhove. Nieuwenhove explained that the gesture technology will enhance established user interfaces and will lead to rising user interaction in previously unexplored markets, such as digital signage.

A professor at the Thayer School of Engineering at Dartmouth and the primary inventor of CMOS pixel image sensor, Dr. Eric R.Fossum will deliver the keynote presentation on “Quanta Image Sensor (QIS) - a possible paradigm shift for the future.”

The participating companies include Aptina, Alexima, Allied Vision Technologies, BBC R&D, Basler, Bosch Security Systems, Chromasens, Dartmouth College, Dexela, Datalogic, Eastman Kodak, European Patent Office, Ecole Centrale de Lyon, Fraunhofer, Flir Systems, Hamamatsu Photonics, IMEC, LG Electronics, Leica Geosystems, Omnivision Technologies, Panasonic, Pira International, Richard Wolf, Siemens, Softkinetic, Sony, STMicroelectronics, TeledyneDALSA, Toshiba, Truesense Imaging, Visera Technologies, and X-Fab Semiconductor.


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