Bosch Sensortec and Akustica to Showcase MEMS Sensor Portfolio at 2013 International CES

Bosch Sensortec and Akustica, two companies of the Bosch Group providing tiny, intelligent MEMS sensors and solutions to the world’s top consumer-electronics manufacturers, will demonstrate their technology in action at the 2013 International CES in Las Vegas.

Bosch Sensortec offers an extensive portfolio of MEMS sensors that dramatically improve the mobile-device user’s experience. The company will showcase its broad range of single-function micro-electromechanical systems (MEMS) inertial sensors; 6- and 9-axis sensor nodes; pressure sensors; magnetic sensors; and highly intelligent sensor-fusion software. Whether used as standalone products, in conjunction with one another, or as co-packaged devices, Bosch Sensortec sensors set size, performance and integration standards for MEMS in consumer electronics.

CES attendees visiting Bosch Sensortec will be able to personally experience the ways in which these sensors ‘interpret’ motion into the digital realm, make the human-machine interface (HMI) more intuitive, and enable novel classes of applications such as augmented reality and indoor navigation.

Akustica will also highlight its latest additions to the Bosch consumer MEMS portfolio: four new MEMS microphones that combine a high signal-to-noise ratio (SNR) and super wideband frequency response with tightly matched sensitivity to deliver HD voice quality. These new microphones improve the performance of the increasing number of voice-enabled applications that consumers use in their daily lives. Because ‘voice starts at the microphone’ – the first component in the audio chain – microphone quality is critical to consumer satisfaction and to mobile device manufacturers that are differentiating some of their newest products based on audio input.

New Execs at Bosch Press Conference, 1/7/13
Newly appointed Akustica and Bosch Sensortec chief executives, Dr. Horst Muenzel, CEO and general manager, Akustica, and Dr. Stefan Finkbeiner, CEO and general manager, Bosch Sensortec, will both attend CES and represent their companies at the Bosch press conference during CES media day. (See press release: “Bosch Sensortec and Akustica Announce New Leadership,” 11/30/12.)

Along with other members of the Bosch leadership team, Muenzel and Finkbeiner will join Dr. Werner Struth, chairman, Robert Bosch LLC, and member of the Board of Management, Robert Bosch GmbH, at the company’s first CES press conference. During the conference, Struth will preview the Bosch CES booth, showing the many Bosch technologies that make life better – including MEMS sensors that enable a more natural interaction with mobile devices and many other applications. The Bosch press conference will take place Jan. 7, 2013, 8:00-8:45 a.m., Mandalay Bay, Level 3, Banyan A.

Akustica and Bosch at First CES MEMS Track, 1/8/13
Klaus Meder, president of the Bosch Automotive Electronics division, and Davin Yuknis, vice president of sales and marketing, Akustica, will participate in MEMS Industry Group’s MEMS conference track. Meder will give the “MEMS Generation” keynote: “Why Miniature ‘Machines’ are Changing the User Experience with Everything,” 9:15 a.m., Tuesday, Jan. 8, 2013, Las Vegas Convention Center (LVCC), North Hall N264.

Yuknis will join the panel, “MEMS, Signal Quality, Smart Sound and the Mobile Handset,” Jan. 8, 2013, 11:20 a.m.-12:00 p.m., LVCC, North Hall, Room N264.

On the Show Floor: Bosch Sensortec and Akustica
Bosch Sensortec and Akustica will demonstrate their newest products as well as consumer-focused demos at the Bosch booth, LVCC, South Hall 1, stand #21322, during exhibition hours.

For More Information
Press who would like to meet with Bosch Sensortec and Akustica, may contact: Maria Vetrano, Vetrano Communications, phone: +1 617 876 2770, email: maria[at]

Business partners may schedule a meeting with the companies by visiting:


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