Feb 22 2013
Tensilica®, Inc. today announced that it will showcase its complete hardware/software intellectual property (IP) solutions that are leading the market in audio, voice, video, imaging and baseband communications at stand 6D101 at the Mobile World Congress, February 25-28, 2013, in Barcelona, Spain.
"We are very excited to showcase at MWC all of the smartphones and tablets that are using Tensilica for audio/voice, Bluetooth, WiFi and LTE baseband processing," stated Jack Guedj, Tensilica's president and CEO. "And with our latest imaging/video DSP (see press release), Tensilica is well positioned to expand our lead as the largest DSP IP supplier."
With its new IVP image/video processor, Tensilica will demonstrate high dynamic range (HDR) capture and video stabilization. Other capabilities, including advanced driver assistance systems (ADAS) features, object and face tracking, feature mapping, and fast warping examples, will also be on display.
Tensilica will have several HiFi audio/voice demonstrations that highlight always-on voice recognition, sound-enhancement technology that delivers dynamic sound from small consumer speakers, and voice echo cancellation, noise reduction and voice quality improvement.
Tensilica will demonstrate the world's first licensable multi-standard DVB-T2 demodulation IP subsystem that can be programmed to meet all the worldwide DTV demodulation standards and showcases Tensilica's ConnX BBE16 DSP.
Tensilica and partner mimoOn will feature a FPGA-based demonstration of a transmitter (eNodeB) PHY layer and a handset PHY layer implemented with Tensilica's ConnX Baseband IP cores. The demonstration shows a download to the handset of two 1080p HD movies and playback on big-screen digital televisions. There is also a simultaneous uplink stream from a camera connected to the handset to a monitor.
Source: http://www.tensilica.com/